Takatoshi Arikawa

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Saga-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder material and electronic part using the same
- Patent number 6,187,114
- Issue date Feb 13, 2001
- Matsushita Electric Industrial Co. Ltd.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and electronic part using the same
- Patent number 6,160,224
- Issue date Dec 12, 2000
- Tanaka Denki Kogyo Kabushiki Kaisha
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wire Bump Material
- Publication number 20080075626
- Publication date Mar 27, 2008
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR