Takatoshi Ishikawa

Person

Furukawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component placement machine having camera units with ver...
- Patent number 7,191,511
- Issue date Mar 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component placement method
- Patent number 7,007,377
- Issue date Mar 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding tool for component
- Patent number 6,543,669
- Issue date Apr 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Seiji Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding tool for component
- Patent number 6,497,354
- Issue date Dec 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Seiji Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method and mounting apparatus and mounting meth...
- Patent number 6,193,143
- Issue date Feb 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal head
- Patent number 5,182,574
- Issue date Jan 26, 1993
- Alps Electric Co., Ltd.
- Masakazu Kato
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Silicon substrate having porous oxidized silicon layers and its pro...
- Patent number 5,156,896
- Issue date Oct 20, 1992
- Alps Electric Co., Ltd.
- Masakazu Katoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silicon substrate having porous oxidized silicon layers and its pro...
- Patent number 5,091,061
- Issue date Feb 25, 1992
- Alps Electric Co., Ltd.
- Masakazu Katoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Ink-jet recording method
- Patent number 4,965,610
- Issue date Oct 23, 1990
- Alps Electric Co., Ltd.
- Takatoshi Ishikawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printing head assembly
- Patent number 4,929,968
- Issue date May 29, 1990
- Alps Electric Co., Ltd.
- Takatoshi Ishikawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heating resistor as a thermal head resistive element
- Patent number 4,751,518
- Issue date Jun 14, 1988
- Alps Electric Co., Ltd.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal print head
- Patent number 4,742,361
- Issue date May 3, 1988
- Alps Electric Co., Ltd.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic component placement machine and electronic component pla...
- Publication number 20050132567
- Publication date Jun 23, 2005
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting method of bump-equipped electronic component and mounting...
- Publication number 20050127141
- Publication date Jun 16, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takatoshi Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component placement machine and electronic component pla...
- Publication number 20040163243
- Publication date Aug 26, 2004
- Kazuhiko Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING TOOL FOR COMPONENT
- Publication number 20030038158
- Publication date Feb 27, 2003
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and bonding tool for component
- Publication number 20020066767
- Publication date Jun 6, 2002
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Takatoshi Ishikawa

Person

Patents Grantslast 30 patents

Electronic component placement machine having camera units with ver...

Electronic component placement method

Bonding apparatus and bonding tool for component

Bonding apparatus and bonding tool for component

Solder bump forming method and mounting apparatus and mounting meth...

Thermal head

Silicon substrate having porous oxidized silicon layers and its pro...

Silicon substrate having porous oxidized silicon layers and its pro...

Ink-jet recording method

Printing head assembly

Heating resistor as a thermal head resistive element

Thermal print head

Patents Applicationslast 30 patents

Electronic component placement machine and electronic component pla...

Mounting method of bump-equipped electronic component and mounting...

Electronic component placement machine and electronic component pla...

BONDING APPARATUS AND BONDING TOOL FOR COMPONENT

Bonding apparatus and bonding tool for component