TAKATOSHI KAWAMURA

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TOKYO, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding tool cooling apparatus and method for cooling bonding tool
- Patent number 9,576,927
- Issue date Feb 21, 2017
- Shinkawa Ltd.
- Osamu Kakutani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BONDING TOOL COOLING APPARATUS AND METHOD FOR COOLING BONDING TOOL
- Publication number 20150333032
- Publication date Nov 19, 2015
- SHINKAWA LTD.
- OSAMU KAKUTANI
- B32 - LAYERED PRODUCTS