Takatoshi Okamoto

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Inspection method of compound semiconductor substrate, compound sem...
- Patent number 7,737,043
- Issue date Jun 15, 2010
- Sumitomo Electric Industries, Ltd.
- Takayuki Nishiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing compound semiconductor wafer
- Patent number 7,078,343
- Issue date Jul 18, 2006
- Sumitomo Electric Industries, Ltd.
- Takatoshi Okamoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Inspection method of compound semiconductor substrate, compound sem...
- Publication number 20070269989
- Publication date Nov 22, 2007
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Takayuki Nishiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing compound semiconductor wafer
- Publication number 20030104696
- Publication date Jun 5, 2003
- Takatoshi Okamoto
- B24 - GRINDING POLISHING