Takatoshi Takikawa

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Susbstrate material for mounting a semiconductor device, substrate...
- Patent number 6,974,558
- Issue date Dec 13, 2005
- Sumotomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat-resistant, creep-resistant aluminum alloy and billet thereof a...
- Patent number 6,962,673
- Issue date Nov 8, 2005
- Sumitomo Electric Sintered Alloy, Ltd.
- Hisao Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Substrate material for mounting a semiconductor device, substrate f...
- Patent number 6,534,190
- Issue date Mar 18, 2003
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Substrate material for mounting a semiconductor device, substrate f...
- Patent number 6,388,273
- Issue date May 14, 2002
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electromagnetic actuator
- Patent number 6,380,832
- Issue date Apr 30, 2002
- Itami Works of Sumitomo Electric Industries, Ltd.
- Hitoshi Oyama
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Valve-open-close mechanism
- Patent number 6,371,063
- Issue date Apr 16, 2002
- Sumitomo Electric Industries, Ltd.
- Hitoshi Oyama
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Combination body of shim and cam
- Patent number 6,367,439
- Issue date Apr 9, 2002
- Sumitomo Electric Industries, Ltd.
- Takao Nishioka
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Substrate material for mounting a semiconductor device, substrate f...
- Patent number 6,183,874
- Issue date Feb 6, 2001
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for manufacturing a semiconductor substrate comprising lami...
- Patent number 5,643,834
- Issue date Jul 1, 1997
- Sumitomo Electric Industries, Ltd.
- Keizo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advance multilayer molded plastic package using mesic technology
- Patent number 5,556,807
- Issue date Sep 17, 1996
- Intel Corporation
- Bidyut K. Bhattacharyya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic package type semiconductor device having a rolled metal sub...
- Patent number 5,455,453
- Issue date Oct 3, 1995
- Sumitomo Electric Industries, Ltd.
- Keizo Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having laminated wiring patterns
- Patent number 5,369,220
- Issue date Nov 29, 1994
- Sumitomo Electric Industries Ltd.
- Keizo Harada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Substrate material for mounting a semiconductor device, substrate f...
- Publication number 20050025654
- Publication date Feb 3, 2005
- Sumitomo Electric Industries, Ltd.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Methods of preparing heat resistant, creep-resistant aluminum alloy
- Publication number 20040175285
- Publication date Sep 9, 2004
- Sumitomo Electric Industries, Ltd.
- Hisao Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Heat-resistant and creep-resistant aluminum alloy and billet thereo...
- Publication number 20030156968
- Publication date Aug 21, 2003
- Hisao Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Susbstrate material for mounting a semiconductor device, substrate...
- Publication number 20020034651
- Publication date Mar 21, 2002
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Shinichi Yamagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electromagnetic actuator
- Publication number 20010007440
- Publication date Jul 12, 2001
- Hitoshi Oyama
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Application
Valve-open-close mechanism
- Publication number 20010006047
- Publication date Jul 5, 2001
- Hitoshi Oyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Takatoshi Takikawa

Person

Patents Grantslast 30 patents

Susbstrate material for mounting a semiconductor device, substrate...

Heat-resistant, creep-resistant aluminum alloy and billet thereof a...

Substrate material for mounting a semiconductor device, substrate f...

Substrate material for mounting a semiconductor device, substrate f...

Electromagnetic actuator

Valve-open-close mechanism

Combination body of shim and cam

Substrate material for mounting a semiconductor device, substrate f...

Process for manufacturing a semiconductor substrate comprising lami...

Advance multilayer molded plastic package using mesic technology

Plastic package type semiconductor device having a rolled metal sub...

Wiring board having laminated wiring patterns

Patents Applicationslast 30 patents

Substrate material for mounting a semiconductor device, substrate f...

Methods of preparing heat resistant, creep-resistant aluminum alloy

Heat-resistant and creep-resistant aluminum alloy and billet thereo...

Susbstrate material for mounting a semiconductor device, substrate...

Electromagnetic actuator

Valve-open-close mechanism