Takatoyo YAMAKAMI

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of mounting semiconductor element, and semiconductor device
- Patent number 9,615,464
- Issue date Apr 4, 2017
- Fujitsu Limited
- Takashi Kubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,266,312
- Issue date Feb 23, 2016
- Fujitsu Limited
- Takatoyo Yamakami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Optical unit in which optical element is mounted on base having opt...
- Patent number 9,195,003
- Issue date Nov 24, 2015
- Fujitsu Limited
- Takatoyo Yamakami
- G02 - OPTICS
Information Patent Grant
Method of manufacturing optical waveguide device and optical wavegu...
- Patent number 8,861,903
- Issue date Oct 14, 2014
- Fujitsu Limited
- Takatoyo Yamakami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic packaging apparatus and electronic packaging method
- Patent number 8,720,519
- Issue date May 13, 2014
- Shinko Electric Industries Co., Ltd.
- Takatoyo Yamakami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...
- Patent number 7,699,235
- Issue date Apr 20, 2010
- Fujitsu Limited
- Shunji Baba
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...
- Patent number 7,540,428
- Issue date Jun 2, 2009
- Fujitsu Limited
- Shunji Baba
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Method of mounting semiconductor chip
- Patent number 7,394,163
- Issue date Jul 1, 2008
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID tag and method of manufacturing RFID tag
- Patent number 7,363,704
- Issue date Apr 29, 2008
- Fujitsu Limited
- Hiroshi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Head assembly, disk unit, and bonding method and apparatus
- Patent number 7,347,347
- Issue date Mar 25, 2008
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Magnetic head tester
- Patent number 7,196,512
- Issue date Mar 27, 2007
- Fujitsu Limited
- Norio Kainuma
- G11 - INFORMATION STORAGE
Information Patent Grant
Design support system
- Patent number 7,133,733
- Issue date Nov 7, 2006
- Fujitsu Limited
- Toru Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Head assembly having integrated circuit chip covered by layer which...
- Patent number 6,885,522
- Issue date Apr 26, 2005
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin coating method
- Patent number 6,770,319
- Issue date Aug 3, 2004
- Fujitsu Limited
- Shunji Baba
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of mounting chip onto printed circuit board in shortened wor...
- Patent number 6,716,665
- Issue date Apr 6, 2004
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chip
- Patent number 6,437,450
- Issue date Aug 20, 2002
- Fujitsu, Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE AND OPTICAL MODULE MANUFACTURING METHOD
- Publication number 20170357063
- Publication date Dec 14, 2017
- Fujitsu Limited
- Shuichi Takeuchi
- G02 - OPTICS
Information Patent Application
COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED...
- Publication number 20170020000
- Publication date Jan 19, 2017
- Fujitsu Limited
- TAKATOYO YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160372441
- Publication date Dec 22, 2016
- Fujitsu Limited
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20140290850
- Publication date Oct 2, 2014
- Fujitsu Limited
- TAKATOYO YAMAKAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
- Publication number 20140285989
- Publication date Sep 25, 2014
- Fujitsu Limited
- Takashi KUBOTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140086525
- Publication date Mar 27, 2014
- Fujitsu Limited
- TAKATOYO YAMAKAMI
- G02 - OPTICS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGU...
- Publication number 20130259421
- Publication date Oct 3, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- G02 - OPTICS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...
- Publication number 20130140069
- Publication date Jun 6, 2013
- Fujitsu Limited
- Masayuki KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...
- Publication number 20130087605
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takashi KUBOTA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE
- Publication number 20120248616
- Publication date Oct 4, 2012
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD
- Publication number 20120043005
- Publication date Feb 23, 2012
- Shinko Electric Industries Co., Ltd.
- Takatoyo YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20110074020
- Publication date Mar 31, 2011
- Fujitsu Limited
- Takatoyo YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...
- Publication number 20080314993
- Publication date Dec 25, 2008
- FUJITSU LIMITED
- Shunji Baba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...
- Publication number 20060043199
- Publication date Mar 2, 2006
- FUJITSU LIMITED
- Shunji Baba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RFID tag and method of manufacturing RFID tag
- Publication number 20060010685
- Publication date Jan 19, 2006
- FUJITSU LIMITED
- Hiroshi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Resin coating method and apparatus
- Publication number 20050196529
- Publication date Sep 8, 2005
- FUJITSU LTD.
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin coating method and apparatus
- Publication number 20050196703
- Publication date Sep 8, 2005
- FUJITSU LTD.
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin coating method and apparatus
- Publication number 20050196704
- Publication date Sep 8, 2005
- FUJITSU LTD.
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Head assembly, disk unit, and bonding method and apparatus
- Publication number 20050057856
- Publication date Mar 17, 2005
- FUJITSU LIMITED
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Design support system
- Publication number 20050038537
- Publication date Feb 17, 2005
- FUJITSU LIMITED
- Toru Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Resin coating method and apparatus
- Publication number 20040213894
- Publication date Oct 28, 2004
- FUJITSU LIMITED
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnetic head tester
- Publication number 20040104722
- Publication date Jun 3, 2004
- FUJITSU LIMITED
- Norio Kainuma
- G11 - INFORMATION STORAGE
Information Patent Application
Method of mounting semiconductor chip
- Publication number 20020164837
- Publication date Nov 7, 2002
- FUJITSU LIMITED
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin coating method and apparatus
- Publication number 20020037363
- Publication date Mar 28, 2002
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting chip onto printed circuit board in shortened wor...
- Publication number 20010040298
- Publication date Nov 15, 2001
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS

Takatoyo YAMAKAMI

Person

Patents Grantslast 30 patents

Method of mounting semiconductor element, and semiconductor device

Bonding apparatus and bonding method

Optical unit in which optical element is mounted on base having opt...

Method of manufacturing optical waveguide device and optical wavegu...

Electronic packaging apparatus and electronic packaging method

Electroconductive bonding material, method for bonding conductor, a...

RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...

RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...

Method of mounting semiconductor chip

RFID tag and method of manufacturing RFID tag

Head assembly, disk unit, and bonding method and apparatus

Magnetic head tester

Design support system

Head assembly having integrated circuit chip covered by layer which...

Resin coating method

Method of mounting chip onto printed circuit board in shortened wor...

Method of mounting semiconductor chip

Patents Applicationslast 30 patents

OPTICAL MODULE AND OPTICAL MODULE MANUFACTURING METHOD

COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BONDING APPARATUS AND BONDING METHOD

METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGU...

CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...

ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...

RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of m...

RFID tag and method of manufacturing RFID tag

Resin coating method and apparatus

Resin coating method and apparatus

Resin coating method and apparatus

Head assembly, disk unit, and bonding method and apparatus

Design support system

Resin coating method and apparatus

Magnetic head tester

Method of mounting semiconductor chip

Resin coating method and apparatus

Method of mounting chip onto printed circuit board in shortened wor...