Takaya Shimizu

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Nirasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor film forming method using hydrazine-based compound gas
- Patent number 11,348,794
- Issue date May 31, 2022
- Tokyo Electron Limited
- Hideo Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming Ti film
- Patent number 9,620,370
- Issue date Apr 11, 2017
- Tokyo Electron Limited
- Seishi Murakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming contact layer
- Patent number 9,349,642
- Issue date May 24, 2016
- Tokyo Electron Limited
- Seishi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD film forming method including annealing and film forming perfor...
- Patent number 6,080,444
- Issue date Jun 27, 2000
- Tokyo Electron Limited
- Takaya Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a CVD film
- Patent number 5,963,834
- Issue date Oct 5, 1999
- Tokyo Electron Limited
- Tatsuo Hatano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20190378723
- Publication date Dec 12, 2019
- TOKYO ELECTRON LIMITED
- Hideo Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING TI FILM
- Publication number 20150179462
- Publication date Jun 25, 2015
- TOKYO ELECTRON LIMITED
- Seishi MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONTACT LAYER
- Publication number 20150179518
- Publication date Jun 25, 2015
- TOKYO ELECTRON LIMITED
- Seishi MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film deposition system
- Publication number 20040168642
- Publication date Sep 2, 2004
- Kentaro Asakura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate treatment device, substrate treatment method, and cleanin...
- Publication number 20040081757
- Publication date Apr 29, 2004
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film forming device
- Publication number 20020166509
- Publication date Nov 14, 2002
- Kentaro Asakura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...