Takayoshi Katahira

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Built-in connector for board-to-board and flex-to-rigid board conne...
- Patent number 12,095,185
- Issue date Sep 17, 2024
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect frames for SIP modules
- Patent number 10,638,608
- Issue date Apr 28, 2020
- Apple Inc.
- Lan H. Hoang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-profile space-efficient shielding for SIP module
- Patent number 10,624,214
- Issue date Apr 14, 2020
- Apple Inc.
- Amir Salehi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Vertical module and perpendicular pin array interconnect for stacke...
- Patent number 10,602,612
- Issue date Mar 24, 2020
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Area-efficient connections to SIP modules
- Patent number 10,334,732
- Issue date Jun 25, 2019
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical shielding and interconnect for SIP modules
- Patent number 10,292,258
- Issue date May 14, 2019
- Apple Inc.
- Lan H. Hoang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
Built-In Connector for Board-to-Board and Flex-to-Rigid Board Conne...
- Publication number 20230089258
- Publication date Mar 23, 2023
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES
- Publication number 20230078536
- Publication date Mar 16, 2023
- Apple Inc.
- Ali N. Ergun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA-EFFICIENT CONNECTIONS TO SIP MODULES
- Publication number 20190098762
- Publication date Mar 28, 2019
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT FRAMES FOR SIP MODULES
- Publication number 20190082538
- Publication date Mar 14, 2019
- Apple Inc.
- Lan H. Hoang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES
- Publication number 20180049311
- Publication date Feb 15, 2018
- Apple Inc.
- Lan H. Hoang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES
- Publication number 20160286647
- Publication date Sep 29, 2016
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE
- Publication number 20160270213
- Publication date Sep 15, 2016
- Apple Inc.
- Amir Salehi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takayoshi Katahira

Person

Patents Grantslast 30 patents

Built-in connector for board-to-board and flex-to-rigid board conne...

Interconnect frames for SIP modules

Low-profile space-efficient shielding for SIP module

Vertical module and perpendicular pin array interconnect for stacke...

Area-efficient connections to SIP modules

Vertical shielding and interconnect for SIP modules

Patents Applicationslast 30 patents

Built-In Connector for Board-to-Board and Flex-to-Rigid Board Conne...

CONDUCTIVE FEATURES ON SYSTEM-IN-PACKAGE SURFACES

AREA-EFFICIENT CONNECTIONS TO SIP MODULES

INTERCONNECT FRAMES FOR SIP MODULES

VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES

VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES

LOW-PROFILE SPACE-EFFICIENT SHIELDING FOR SIP MODULE