Takayuki Hasegawa

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding material and circuit device using the same
- Patent number 7,224,066
- Issue date May 29, 2007
- Sanyo Electric Co., LTD
- Toshimichi Naruse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bonding material and circuit device using the same
- Publication number 20050046032
- Publication date Mar 3, 2005
- Toshimichi Naruse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR