Takayuki Higuchi

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition, method of manufacturing the same a...
- Patent number 8,697,237
- Issue date Apr 15, 2014
- Panasonic Corporation
- Hirohisa Hino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrically conductive paste, and electrical and electronic device...
- Patent number 8,540,903
- Issue date Sep 24, 2013
- Panasonic Corporation
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing mounting structure and mounting structure
- Patent number 8,436,253
- Issue date May 7, 2013
- Panasonic Corporation
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and mounting structure using the same
- Patent number 8,182,923
- Issue date May 22, 2012
- Panasonic Corporation
- Naomichi Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting method, flip-chip mounting apparatus and tool pr...
- Patent number 8,163,599
- Issue date Apr 24, 2012
- Panasonic Corporation
- Yoshihiro Tomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electroconductive bonding material and electric/electronic device u...
- Patent number 8,012,379
- Issue date Sep 6, 2011
- Panasonic Corporation
- Hidenori Miyakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically conductive adhesive
- Patent number 7,785,500
- Issue date Aug 31, 2010
- Panasonic Corporation
- Atsushi Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, METHOD OF MANUFACTURING THE SAME A...
- Publication number 20130237645
- Publication date Sep 12, 2013
- Panasonic Corporation
- Hirohisa Hino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130068513
- Publication date Mar 21, 2013
- KYOTO ELEX CO., LTD.
- Shogo Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME
- Publication number 20130062107
- Publication date Mar 14, 2013
- PANASONIC CORPORATION
- Takayuki Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130008698
- Publication date Jan 10, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE
- Publication number 20110061913
- Publication date Mar 17, 2011
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE...
- Publication number 20110049439
- Publication date Mar 3, 2011
- Takayuki Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...
- Publication number 20110020983
- Publication date Jan 27, 2011
- PANASONIC CORPORATION
- Yoshihiro Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE U...
- Publication number 20100316794
- Publication date Dec 16, 2010
- Hidenori Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100276803
- Publication date Nov 4, 2010
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thermosetting Resin Composition, Method of Manufacturing the Same a...
- Publication number 20100147567
- Publication date Jun 17, 2010
- PANASONIC ELECTRIC WORKS CO., LTD.
- Hirohisa Hino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...
- Publication number 20090301771
- Publication date Dec 10, 2009
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20090269598
- Publication date Oct 29, 2009
- Naomichi OHASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE
- Publication number 20090114885
- Publication date May 7, 2009
- Atsushi Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroconductive Bonding Material and Electric/Electronic Device U...
- Publication number 20090032293
- Publication date Feb 5, 2009
- Hidenori Miyakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Takayuki Higuchi

Person

Patents Grantslast 30 patents

Thermosetting resin composition, method of manufacturing the same a...

Electrically conductive paste, and electrical and electronic device...

Method of manufacturing mounting structure and mounting structure

Conductive paste and mounting structure using the same

Flip-chip mounting method, flip-chip mounting apparatus and tool pr...

Electroconductive bonding material and electric/electronic device u...

Electrically conductive adhesive

Patents Applicationslast 30 patents

THERMOSETTING RESIN COMPOSITION, METHOD OF MANUFACTURING THE SAME A...

WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME

MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

METHOD OF MANUFACTURING MOUNTING STRUCTURE AND MOUNTING STRUCTURE

ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE...

FLIP-CHIP MOUNTING METHOD, FLIP-CHIP MOUNTING APPARATUS AND TOOL PR...

ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE U...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Thermosetting Resin Composition, Method of Manufacturing the Same a...

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...

CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME

ELECTRICALLY CONDUCTIVE ADHESIVE

Electroconductive Bonding Material and Electric/Electronic Device U...