Takayuki Hisaka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,033,905
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and semiconductor apparatus leak inspection...
- Patent number 11,967,537
- Issue date Apr 23, 2024
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,088,074
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Kazuhiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,790,397
- Issue date Sep 29, 2020
- Mitsubishi Electric Corporation
- Tasuku Sumino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,388,585
- Issue date Aug 20, 2019
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,224,294
- Issue date Mar 5, 2019
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,627,282
- Issue date Apr 18, 2017
- Mitsubishi Electric Corporation
- Tasuku Sumino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,766,445
- Issue date Jul 1, 2014
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,876,011
- Issue date Apr 5, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 5,728,611
- Issue date Mar 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airbridge wiring structure for MMIC
- Patent number 5,677,574
- Issue date Oct 14, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220044978
- Publication date Feb 10, 2022
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS LEAK INSPECTION...
- Publication number 20210313242
- Publication date Oct 7, 2021
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200020632
- Publication date Jan 16, 2020
- Mitsubishi Electric Corporation
- Kazuhiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190378935
- Publication date Dec 12, 2019
- Mitsubishi Electric Corporation
- Tasuku SUMINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180138132
- Publication date May 17, 2018
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180122718
- Publication date May 3, 2018
- Mitsubishi Electric Corporation
- Takayuki HISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160343624
- Publication date Nov 24, 2016
- Mitsubishi Electric Corporation
- Tasuku SUMINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130093061
- Publication date Apr 18, 2013
- Mitsubishi Electric Corporation
- Takayuki HISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090200644
- Publication date Aug 13, 2009
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050167698
- Publication date Aug 4, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS

Takayuki Hisaka

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor apparatus and semiconductor apparatus leak inspection...

Semiconductor device and method for manufacturing same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device

Method of fabricating semiconductor device

Airbridge wiring structure for MMIC

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS LEAK INSPECTION...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device