Takayuki IWAKI

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,946,044
- Issue date Feb 3, 2015
- Renesas Electronics Corporation
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,368,176
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lower layer wiring
- Patent number 8,288,840
- Issue date Oct 16, 2012
- Renesas Electronics Corporation
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including hydrogen barrier film for covering m...
- Patent number 8,237,208
- Issue date Aug 7, 2012
- Renesas Electronics Corporation
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including semiconductor chip with stress ma...
- Patent number 7,956,461
- Issue date Jun 7, 2011
- Renesas Electronics Corporation
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130089964
- Publication date Apr 11, 2013
- Renesas Elecronics Corporation
- Takayuki IWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, LOWER LAYER WIRING DESIGNING DEVICE, METHOD O...
- Publication number 20130001745
- Publication date Jan 3, 2013
- RENESAS ELECTRONICS CORPORATION
- Takayuki IWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110304017
- Publication date Dec 15, 2011
- RENESAS ELECTRONICS CORPORATION
- Takayuki IWAKI
- H01 - BASIC ELECTRIC ELEMENTS