Takayuki Katsuno

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Ogaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic component attached wiring board
- Patent number 10,477,699
- Issue date Nov 12, 2019
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with conductor post having multiple surface ro...
- Patent number 10,070,523
- Issue date Sep 4, 2018
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,980,371
- Issue date May 22, 2018
- Ibiden Co., Ltd.
- Takayuki Katsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ATTACHED WIRING BOARD
- Publication number 20170257952
- Publication date Sep 7, 2017
- IBIDEN CO., LTD.
- Takema ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160316558
- Publication date Oct 27, 2016
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160242285
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Takayuki Katsuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR