Takayuki MAEKURA

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device containing self-aligned isolation s...
- Patent number 12,127,406
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 11,367,736
- Issue date Jun 21, 2022
- SanDisk Technologies LLC
- Hirofumi Tokita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 11,355,506
- Issue date Jun 7, 2022
- SanDisk Technologies LLC
- Hirofumi Tokita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING INCLINED WORD LINE CONTAC...
- Publication number 20240414916
- Publication date Dec 12, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
Information Patent Application
MEMORY DEVICE INCLUDING WORD LINE CONTACT STRIPS AND METHODS OF FOR...
- Publication number 20240414917
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Mark D. KRAMAN
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INVERTED STAIRCASE AND M...
- Publication number 20240260268
- Publication date Aug 1, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUC...
- Publication number 20240196612
- Publication date Jun 13, 2024
- SANDISK TECHNOLOGIES LLC
- Akihiro TOBIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUC...
- Publication number 20240194262
- Publication date Jun 13, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE...
- Publication number 20240179909
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Akihiro TOBIOKA
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...
- Publication number 20240178129
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIE...
- Publication number 20240179904
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...
- Publication number 20240179906
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE...
- Publication number 20240178130
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Akihiro TOBIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...
- Publication number 20240179905
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED ISOLATION S...
- Publication number 20230232624
- Publication date Jul 20, 2023
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20210366920
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20210366924
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
- H01 - BASIC ELECTRIC ELEMENTS

Takayuki MAEKURA

Person

Patents Grantslast 30 patents

Three-dimensional memory device containing self-aligned isolation s...

Through-stack contact via structures for a three-dimensional memory...

Through-stack contact via structures for a three-dimensional memory...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING INCLINED WORD LINE CONTAC...

MEMORY DEVICE INCLUDING WORD LINE CONTACT STRIPS AND METHODS OF FOR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INVERTED STAIRCASE AND M...

THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUC...

THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUC...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIE...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED ISOLATION S...

THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...