Takayuki Masada

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Expanding apparatus
- Patent number 12,255,087
- Issue date Mar 18, 2025
- Disco Corporation
- Tomohito Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing apparatus
- Patent number 11,254,029
- Issue date Feb 22, 2022
- Disco Corporation
- Takayuki Masada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack and thickness detecting apparatus
- Patent number 9,453,820
- Issue date Sep 27, 2016
- Disco Corporation
- Takayuki Masada
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION TRANSMISSION METHOD
- Publication number 20250013548
- Publication date Jan 9, 2025
- Disco Corporation
- Yoshihiro KAWAGUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HOLDING UNIT
- Publication number 20230339055
- Publication date Oct 26, 2023
- Disco Corporation
- Takayuki MASADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANSION METHOD
- Publication number 20230298925
- Publication date Sep 21, 2023
- Disco Corporation
- Atsushi UEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING APPARATUS
- Publication number 20230170246
- Publication date Jun 1, 2023
- Disco Corporation
- Tomohito Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING METHOD AND EXPANDING APPARATUS
- Publication number 20210028063
- Publication date Jan 28, 2021
- Disco Corporation
- Jinyan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DIVIDING APPARATUS
- Publication number 20200171707
- Publication date Jun 4, 2020
- Disco Corporation
- Takayuki MASADA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CRACK AND THICKNESS DETECTING APPARATUS
- Publication number 20150027227
- Publication date Jan 29, 2015
- Disco Corporation
- Takayuki Masada
- G01 - MEASURING TESTING