Takayuki Naba

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic metal circuit board and semiconductor device using the same
- Patent number 11,973,003
- Issue date Apr 30, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, circuit board, and semiconductor device
- Patent number 11,948,900
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic metal circuit board and semiconductor device using the same
- Patent number 11,594,467
- Issue date Feb 28, 2023
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and semiconductor module
- Patent number 10,952,317
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic metal circuit board and semiconductor device using the same
- Patent number 10,872,841
- Issue date Dec 22, 2020
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and semiconductor device
- Patent number 10,790,214
- Issue date Sep 29, 2020
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and semiconductor module
- Patent number 10,595,403
- Issue date Mar 17, 2020
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and semiconductor device
- Patent number 10,515,868
- Issue date Dec 24, 2019
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module using...
- Patent number 10,366,938
- Issue date Jul 30, 2019
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride circuit board and electronic component module using...
- Patent number 10,109,555
- Issue date Oct 23, 2018
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic/copper circuit board and semiconductor device
- Patent number 9,357,643
- Issue date May 31, 2016
- Kabushiki Kaisha Toshiba
- Keiichi Yano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic component module
- Patent number 9,214,617
- Issue date Dec 15, 2015
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation sheet made from silicon nitride, and semiconductor modul...
- Patent number 8,916,961
- Issue date Dec 23, 2014
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic metal composite and semiconductor device using the same
- Patent number 8,518,554
- Issue date Aug 27, 2013
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 8,273,993
- Issue date Sep 25, 2012
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride ceramic substrate, silicon nitride ceramic circuit...
- Patent number 6,613,443
- Issue date Sep 2, 2003
- Kabushiki Kaisha Toshiba
- Michiyasu Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and method of manufacturing the same
- Patent number 6,569,514
- Issue date May 27, 2003
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board
- Patent number 6,426,154
- Issue date Jul 30, 2002
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board with a metal plate projected to prevent solde...
- Patent number 6,284,985
- Issue date Sep 4, 2001
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Silicon nitride circuit board and semiconductor module
- Patent number 6,232,657
- Issue date May 15, 2001
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic circuit board
- Patent number 5,807,626
- Issue date Sep 15, 1998
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board
- Patent number 5,672,848
- Issue date Sep 30, 1997
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board with a curved lead terminal
- Patent number 5,328,751
- Issue date Jul 12, 1994
- Kabushiki Kaisha Toshiba
- Hiroshi Komorita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ceramic Metal Circuit Board And Semiconductor Device Using The Same
- Publication number 20230154826
- Publication date May 18, 2023
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20210398928
- Publication date Dec 23, 2021
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR MODULE
- Publication number 20200178387
- Publication date Jun 4, 2020
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20200013696
- Publication date Jan 9, 2020
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20190385926
- Publication date Dec 19, 2019
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR MODULE
- Publication number 20190150278
- Publication date May 16, 2019
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON NITRIDE CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING...
- Publication number 20190006261
- Publication date Jan 3, 2019
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20180190568
- Publication date Jul 5, 2018
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING...
- Publication number 20180019182
- Publication date Jan 18, 2018
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20180005918
- Publication date Jan 4, 2018
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET MADE FROM SILICON NITRIDE, AND SEMICONDUCTOR MODUL...
- Publication number 20150061107
- Publication date Mar 5, 2015
- Kabushiki Kaisha Toshiba
- Takayuki NABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC/COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20140291699
- Publication date Oct 2, 2014
- Keiichi YANO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20120305304
- Publication date Dec 6, 2012
- TOSHIBA MATERIALS CO., LTD.
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET MADE FROM SILICON NITRIDE, AND SEMICONDUCTOR MODUL...
- Publication number 20120119349
- Publication date May 17, 2012
- TOSHIBA MATERIALS CO., LTD.
- Takayuki Naba
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY...
- Publication number 20090283309
- Publication date Nov 19, 2009
- KABUSHIKI KAISHA TOSHIBA
- Takayuki Naba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING NONFLAT CERAMIC SUBSTRATE
- Publication number 20090090452
- Publication date Apr 9, 2009
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20090056996
- Publication date Mar 5, 2009
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermoelectric Conversion Module, Heat Exchanger Using Same, and Th...
- Publication number 20080135082
- Publication date Jun 12, 2008
- Kabushiki Kaisha Toshiba
- Shinsuke Hirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon nitride ceramic substrate, silicon nitride ceramic circuit...
- Publication number 20020084103
- Publication date Jul 4, 2002
- KABUSHIKI KAISHA TOSHIBA
- Michiyasu Komatsu
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Ceramic circuit board and method of manufacturing the same
- Publication number 20020060091
- Publication date May 23, 2002
- Kabushiki Kaisha Toshiba
- Takayuki Naba
- H01 - BASIC ELECTRIC ELEMENTS

Takayuki Naba

Person

Patents Grantslast 30 patents

Ceramic metal circuit board and semiconductor device using the same

Bonded body, circuit board, and semiconductor device

Ceramic metal circuit board and semiconductor device using the same

Ceramic circuit board and semiconductor module

Ceramic metal circuit board and semiconductor device using the same

Circuit substrate and semiconductor device

Ceramic circuit board and semiconductor module

Circuit substrate and semiconductor device

Silicon nitride circuit board and electronic component module using...

Silicon nitride circuit board and electronic component module using...

Ceramic/copper circuit board and semiconductor device

Electronic component module

Insulation sheet made from silicon nitride, and semiconductor modul...

Ceramic metal composite and semiconductor device using the same

Electronic component module

Silicon nitride ceramic substrate, silicon nitride ceramic circuit...

Ceramic circuit board and method of manufacturing the same

Ceramic circuit board

Ceramic circuit board with a metal plate projected to prevent solde...

Silicon nitride circuit board and semiconductor module

Ceramic circuit board

Ceramic circuit board

Ceramic circuit board with a curved lead terminal

Patents Applicationslast 30 patents

Ceramic Metal Circuit Board And Semiconductor Device Using The Same

BONDED BODY, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR MODULE

CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE

CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME

CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR MODULE

SILICON NITRIDE CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING...

CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME

SILICON NITRIDE CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING...

CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE

INSULATION SHEET MADE FROM SILICON NITRIDE, AND SEMICONDUCTOR MODUL...

CERAMIC/COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MODULE

INSULATION SHEET MADE FROM SILICON NITRIDE, AND SEMICONDUCTOR MODUL...

CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY...

PROCESS FOR PRODUCING NONFLAT CERAMIC SUBSTRATE

ELECTRONIC COMPONENT MODULE

Thermoelectric Conversion Module, Heat Exchanger Using Same, and Th...

Silicon nitride ceramic substrate, silicon nitride ceramic circuit...

Ceramic circuit board and method of manufacturing the same