Takayuki OHBA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,002,781
- Issue date Jun 4, 2024
- Tokyo Institute of Technology
- Takayuki Ohba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,756,891
- Issue date Sep 12, 2023
- Tokyo Institute of Technology
- Takayuki Ohba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and control method thereof
- Patent number 11,456,028
- Issue date Sep 27, 2022
- Honda Motor Co., Ltd.
- Koji Sakui
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,437,349
- Issue date Sep 6, 2022
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising memory semiconductor chip in which...
- Patent number 11,404,396
- Issue date Aug 2, 2022
- Honda Motor Co., Ltd.
- Koji Sakui
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus including penetration electrodes connecting...
- Patent number 11,309,290
- Issue date Apr 19, 2022
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,302,379
- Issue date Apr 12, 2022
- Honda Motor Co., Ltd.
- Koji Sakui
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of producing semiconductor device
- Patent number 9,748,217
- Issue date Aug 29, 2017
- The University of Tokyo
- Takayuki Ohba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,415,202
- Issue date Apr 9, 2013
- The University of Tokyo
- Takayuki Ohba
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031455
- Publication date Jan 23, 2025
- Advantest Corporation
- Shinji SUGATANI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
- Publication number 20240290741
- Publication date Aug 29, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP
- Publication number 20240234352
- Publication date Jul 11, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20240234308
- Publication date Jul 11, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, STRUCTURE, AND MANUFACTURING METHOD FOR EXPANDING CHIP HEAT...
- Publication number 20240186208
- Publication date Jun 6, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP
- Publication number 20240136314
- Publication date Apr 25, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20240136283
- Publication date Apr 25, 2024
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF STACKED DEVICE AND STACKED DEVICE
- Publication number 20230098533
- Publication date Mar 30, 2023
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230021125
- Publication date Jan 19, 2023
- TOKYO INSTITUTE OF TECHNOLOGY
- Takayuki OHBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220208683
- Publication date Jun 30, 2022
- TOKYO INSTITUTE OF TECHNOLOGY
- Takayuki OHBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220208710
- Publication date Jun 30, 2022
- TOKYO INSTITUTE OF TECHNOLOGY
- Takayuki OHBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF
- Publication number 20210280234
- Publication date Sep 9, 2021
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210225810
- Publication date Jul 22, 2021
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210225427
- Publication date Jul 22, 2021
- Honda Motor Co., Ltd.
- Koji Sakui
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210202477
- Publication date Jul 1, 2021
- Advantest Corporation
- Shinji SUGATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210118863
- Publication date Apr 22, 2021
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210104497
- Publication date Apr 8, 2021
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210104272
- Publication date Apr 8, 2021
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200303009
- Publication date Sep 24, 2020
- Honda Motor Co., Ltd.
- Koji Sakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110165730
- Publication date Jul 7, 2011
- THE UNIVERSITY OF TOKYO
- Takayuki OHBA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Takayuki OHBA

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing same

Semiconductor device and method for manufacturing same

Semiconductor device and control method thereof

Semiconductor device

Semiconductor device comprising memory semiconductor chip in which...

Semiconductor apparatus including penetration electrodes connecting...

Semiconductor apparatus

Method of producing semiconductor device

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD

STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

METHOD, STRUCTURE, AND MANUFACTURING METHOD FOR EXPANDING CHIP HEAT...

STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

FABRICATION METHOD OF STACKED DEVICE AND STACKED DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE