Takayuki Sueyoshi

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Kodaira-shi, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin coated metal foil, metal clad laminate, printed wiring board...
- Patent number 7,955,689
- Issue date Jun 7, 2011
- Hitachi Chemical Co, Ltd.
- Kenji Takai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin coated metal foil, metal clad laminate, printed wiring board...
- Patent number 7,749,605
- Issue date Jul 6, 2010
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin coated metal foil, metal clad laminate, printed wiring board...
- Patent number 7,749,612
- Issue date Jul 6, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil with resin and metal-clad laminate, and printed wiring b...
- Patent number 7,473,458
- Issue date Jan 6, 2009
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD...
- Publication number 20090032287
- Publication date Feb 5, 2009
- Kenji TAKAI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD...
- Publication number 20080277143
- Publication date Nov 13, 2008
- Kenji TAKAI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COATED METAL FOIL, METAL CLAD LAMINATE, PRINTED WIRING BOARD...
- Publication number 20080011612
- Publication date Jan 17, 2008
- Kenji TAKAI
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal foil with resin and metal-clad laminate, and printed wiring b...
- Publication number 20050121229
- Publication date Jun 9, 2005
- Kenji Takai
- B32 - LAYERED PRODUCTS