TREA

Takayuki Taguchi

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  • Hanyu, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Methods and apparatus for improved bonding
    • Patent number 10,050,009
    • Issue date Aug 14, 2018
    • Semiconductor Components Industries, LLC
    • Nobuhisa Onai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacture an electric circuit
    • Patent number 9,699,915
    • Issue date Jul 4, 2017
    • Semiconductor Components Industries, LLC
    • Hiroshi Inoguchi
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

  • Information Patent Application

    METHODS AND APPARATUS FOR IMPROVED BONDING
    • Publication number 20170077061
    • Publication date Mar 16, 2017
    • Semiconductor Components Industries, LLC
    • Nobuhisa ONAI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE
    • Publication number 20160105964
    • Publication date Apr 14, 2016
    • Semiconductor Components Industries, LLC
    • Hiroshi Inoguchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR