Takayuki Takahashi

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 9,713,253
- Issue date Jul 18, 2017
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooled integrated substrate and manufacturing method of liqu...
- Patent number 9,320,129
- Issue date Apr 19, 2016
- Dowa Metaltech Co., Ltd.
- Hisashi Hori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fin-integrated substrate and manufacturing method of fin-integrated...
- Patent number 8,927,873
- Issue date Jan 6, 2015
- Dowa Metaltech Co., Ltd.
- Hisashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal/ceramic bonding substrate
- Patent number 7,926,543
- Issue date Apr 19, 2011
- Dowa Metaltech Co., Ltd.
- Akira Sugawara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,189,449
- Issue date Mar 13, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding article and method for producing same
- Patent number 7,159,757
- Issue date Jan 9, 2007
- Dowa Mining Co., Ltd.
- Takayuki Takahashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,122,243
- Issue date Oct 17, 2006
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 7,073,703
- Issue date Jul 11, 2006
- Dowa Mining Co., Ltd.
- Takayuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding article and method for producing same
- Patent number 6,858,151
- Issue date Feb 22, 2005
- Dowa Mining Co., Ltd.
- Nobuyoshi Tsukaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and power module
- Patent number 6,791,180
- Issue date Sep 14, 2004
- Dowa Mining Co., Ltd.
- Yukihiro Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding article and method for producing same
- Patent number 6,780,520
- Issue date Aug 24, 2004
- Dowa Mining Co., Ltd.
- Nobuyoshi Tsukaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140057131
- Publication date Feb 27, 2014
- DOWA METALTECH CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQU...
- Publication number 20120305292
- Publication date Dec 6, 2012
- NIPPON LIGHT METAL COMPANY, LTD.
- Hisashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN-INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF FIN-INTEGRATED...
- Publication number 20120279761
- Publication date Nov 8, 2012
- NIPPON LIGHT METAL COMPANY, LTD.
- Hisashi Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat radiator
- Publication number 20070227697
- Publication date Oct 4, 2007
- Dowa Metaltech Co., Ltd.
- Takayuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing metal/ceramic bonding substrate
- Publication number 20070227685
- Publication date Oct 4, 2007
- Dowa Metaltech Co., Ltd.
- Akira Sugawara
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20050084704
- Publication date Apr 21, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20050079329
- Publication date Apr 14, 2005
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum/ceramic bonding substrate and method for producing same
- Publication number 20040074951
- Publication date Apr 22, 2004
- Takayuki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal/ceramic bonding article and method for producing same
- Publication number 20040060968
- Publication date Apr 1, 2004
- Takayuki Takahashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Metal/ceramic bonding article and method for producing same
- Publication number 20030232204
- Publication date Dec 18, 2003
- Nobuyoshi Tsukaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal/ceramic bonding article and method for producing same
- Publication number 20030232205
- Publication date Dec 18, 2003
- Nobuyoshi Tsukaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Ceramic circuit board and power module
- Publication number 20030173660
- Publication date Sep 18, 2003
- Yukihiro Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takayuki Takahashi

Person

Patents Grantslast 30 patents

Metal/ceramic bonding substrate and method for producing same

Liquid-cooled integrated substrate and manufacturing method of liqu...

Fin-integrated substrate and manufacturing method of fin-integrated...

Method for producing metal/ceramic bonding substrate

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding article and method for producing same

Metal/ceramic bonding substrate and method for producing same

Aluminum/ceramic bonding substrate and method for producing same

Metal/ceramic bonding article and method for producing same

Ceramic circuit board and power module

Metal/ceramic bonding article and method for producing same

Patents Applicationslast 30 patents

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQU...

FIN-INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF FIN-INTEGRATED...

Heat radiator

Method for producing metal/ceramic bonding substrate

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Aluminum/ceramic bonding substrate and method for producing same

Metal/ceramic bonding article and method for producing same

Metal/ceramic bonding article and method for producing same

Metal/ceramic bonding article and method for producing same

Ceramic circuit board and power module