Takayuki Ushio

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Package apparatus of power semiconductor device
- Patent number 8,872,313
- Issue date Oct 28, 2014
- Mitsubishi Electric Corporation
- Takayuki Ushio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE APPARATUS OF POWER SEMICONDUCTOR DEVICE
- Publication number 20120074543
- Publication date Mar 29, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Takayuki Ushio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL