Takayuki YONEZAWA

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of making printed circuit board and laminated structure
- Patent number 11,343,918
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Shigeaki Uemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition for printed wiring boards, bonding film, cover...
- Patent number 10,244,626
- Issue date Mar 26, 2019
- Sumitomo Electric Industries, Ltd.
- Takayuki Yonezawa
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD AND LAMINATED STRUCTURE
- Publication number 20210045250
- Publication date Feb 11, 2021
- Sumitomo Electric Industries, Ltd.
- Shigeaki UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION FOR PRINTED WIRING BOARDS, BONDING FILM, COVER...
- Publication number 20160198570
- Publication date Jul 7, 2016
- SUMITOMO ELECTROC INDUSTRIES, LTD.
- Takayuki YONEZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...