Takehiko MAEDA

Person

Takasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light projection device
- Patent number 10,895,373
- Issue date Jan 19, 2021
- Ushio Lighting, Inc.
- Takehiko Maeda
- F21 - LIGHTING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,181,450
- Issue date Jan 15, 2019
- Renesas Electronics Corporation
- Seiya Isozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,853,005
- Issue date Dec 26, 2017
- Renesas Electronics Corporation
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,659,888
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,299,632
- Issue date Mar 29, 2016
- Renesas Electronics Corporation
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,975,150
- Issue date Mar 10, 2015
- Renesas Electronics Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,536,691
- Issue date Sep 17, 2013
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 8,389,414
- Issue date Mar 5, 2013
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including an LSI chip and a method for manufac...
- Patent number 8,043,953
- Issue date Oct 25, 2011
- Renesas Electronics Corporation
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,035,217
- Issue date Oct 11, 2011
- NEC Corporation
- Kentaro Mori
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,999,401
- Issue date Aug 16, 2011
- NEC Corporation
- Hideya Murai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring board, semiconductor device using wiring board and their man...
- Patent number 7,911,038
- Issue date Mar 22, 2011
- Renesas Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrate and semiconductor device
- Patent number 7,745,736
- Issue date Jun 29, 2010
- NEC Electronics Corporation
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate and semiconductor device
- Patent number 7,701,726
- Issue date Apr 20, 2010
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 7,674,989
- Issue date Mar 9, 2010
- NEC Electronics Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
- Patent number 7,649,749
- Issue date Jan 19, 2010
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light thin stacked package semiconductor device and process for fab...
- Patent number 6,762,488
- Issue date Jul 13, 2004
- NEC Electronics Corporation
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230378032
- Publication date Nov 23, 2023
- RENESAS ELECTRONICS CORPORATION
- Kosuke KITAICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369179
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT PROJECTION DEVICE
- Publication number 20200408393
- Publication date Dec 31, 2020
- Ushio Lighting, Inc.
- Takehiko MAEDA
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180068964
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170287868
- Publication date Oct 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Seiya ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160163667
- Publication date Jun 9, 2016
- Renesas Electronics Corporation
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160013142
- Publication date Jan 14, 2016
- RENESAS ELECTRONICS CORPORATION
- Takehiko MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150061159
- Publication date Mar 5, 2015
- RENESAS ELECTRONICS CORPORATION
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130127050
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Yuichi MIYAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER
- Publication number 20130005090
- Publication date Jan 3, 2013
- Yuko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110281401
- Publication date Nov 17, 2011
- RENESAS ELECTRONICS CORPORATION
- Kentaro MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A WIRING BOARD
- Publication number 20110136298
- Publication date Jun 9, 2011
- NEC Corporation
- Katsumi KIKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a semiconductor device having a heat spreader
- Publication number 20110104872
- Publication date May 5, 2011
- RENESAS ELECTRONICS CORPORATION
- Yuko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...
- Publication number 20100232127
- Publication date Sep 16, 2010
- NEC ELECTRONICS CORPORATION
- Kentaro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20100117244
- Publication date May 13, 2010
- NEC Electronics Corporation
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device having a heat spreader
- Publication number 20100105170
- Publication date Apr 29, 2010
- NEC Electronics Corporation
- Yuko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...
- Publication number 20090315190
- Publication date Dec 24, 2009
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090294951
- Publication date Dec 3, 2009
- NEC CORPORATION
- Hideya Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090283895
- Publication date Nov 19, 2009
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20090137085
- Publication date May 28, 2009
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20090026636
- Publication date Jan 29, 2009
- NEC Corporation
- Hideya MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080303136
- Publication date Dec 11, 2008
- NEC Corporation
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER S...
- Publication number 20080272829
- Publication date Nov 6, 2008
- NEC ELECTRONICS CORPORATION
- Takehiko Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, semiconductor device, and method of manufacturing...
- Publication number 20080012140
- Publication date Jan 17, 2008
- NEC Electronics Corporation
- Jun Tsukano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and method for manufacturing the same
- Publication number 20060283629
- Publication date Dec 21, 2006
- NEC Corporation
- Katsumi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method for manufacturing same, and semiconductor package
- Publication number 20060283625
- Publication date Dec 21, 2006
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrate and semiconductor device
- Publication number 20060192287
- Publication date Aug 31, 2006
- Kenta Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light thin stacked package semiconductor device and process for fab...
- Publication number 20030178716
- Publication date Sep 25, 2003
- Takehiko Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin encapsulated BGA-type semiconductor device
- Publication number 20030166314
- Publication date Sep 4, 2003
- Yoshihiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

Takehiko MAEDA

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Light projection device

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device

Semiconductor device manufacturing method

Semiconductor device and method for manufacturing the same

Method of manufacturing a wiring board

Semiconductor device including an LSI chip and a method for manufac...

Semiconductor device and method for manufacturing same

Semiconductor device and method of manufacturing same

Wiring board, semiconductor device using wiring board and their man...

Wiring board, method for manufacturing same, and semiconductor package

Interconnecting substrate and semiconductor device

Method of manufacturing a wiring substrate and semiconductor device

Wiring board and method for manufacturing the same

Wiring substrate, semiconductor device, and method of manufacturing...

Light thin stacked package semiconductor device and process for fab...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

LIGHT PROJECTION DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING A WIRING BOARD

Method of manufacturing a semiconductor device having a heat spreader

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR M...

Semiconductor device and manufacturing method therefor

Method for manufacturing a semiconductor device having a heat spreader

WIRING BOARD, SEMICONDUCTOR DEVICE USING WIRING BOARD AND THEIR MAN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING A WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER S...

Wiring substrate, semiconductor device, and method of manufacturing...

Wiring board and method for manufacturing the same

Wiring board, method for manufacturing same, and semiconductor package

Interconnecting substrate and semiconductor device

Light thin stacked package semiconductor device and process for fab...

Resin encapsulated BGA-type semiconductor device