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Takehiko SENOO
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Osaka-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Cutting method of workpiece by forming reformed region and dry etch...
Patent number
11,482,455
Issue date
Oct 25, 2022
Iwatani Corporation
Toshiki Manabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cutting method
Patent number
11,380,586
Issue date
Jul 5, 2022
Iwatani Corporation
Toshiki Manabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gas cluster processing device and gas cluster processing method
Patent number
11,267,021
Issue date
Mar 8, 2022
Tokyo Electron Limited
Kazuya Dobashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for supplying mixed gas
Patent number
9,533,268
Issue date
Jan 3, 2017
Iwatani Corporation
Kunihiko Koike
G05 - CONTROLLING REGULATING
Information
Patent Grant
Substrate cleaning apparatus and vacuum processing system
Patent number
9,214,364
Issue date
Dec 15, 2015
Tokyo Electron Limited
Kazuya Dobashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Dividing method for wafer
Patent number
9,159,622
Issue date
Oct 13, 2015
Disco Corporation
Sakae Matsuzaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cluster jet processing method, semiconductor element, microelectrom...
Patent number
8,461,051
Issue date
Jun 11, 2013
Iwatani Corporation
Kunihiko Koike
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
GAS CLUSTER PROCESSING DEVICE AND GAS CLUSTER PROCESSING METHOD
Publication number
20220143655
Publication date
May 12, 2022
TOKYO ELECTRON LIMITED
Kazuya DOBASHI
B08 - CLEANING
Information
Patent Application
Gas Cluster Processing Device and Gas Cluster Processing Method
Publication number
20210107041
Publication date
Apr 15, 2021
TOKYO ELECTRON LIMITED
Kazuya DOBASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CUTTING METHOD
Publication number
20200365460
Publication date
Nov 19, 2020
IWATANI CORPORATION
Toshiki MANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CUTTING METHOD
Publication number
20200365461
Publication date
Nov 19, 2020
IWATANI CORPORATION
Toshiki MANABE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIVIDING METHOD FOR WAFER
Publication number
20150044857
Publication date
Feb 12, 2015
Disco Corporation
Sakae Matsuzaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR SUPPLYING MIXED GAS
Publication number
20150020890
Publication date
Jan 22, 2015
IWATANI CORPORATION
Kunihiko KOIKE
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Application
PROCESSING METHOD UTILIZING CLUSTER
Publication number
20140061031
Publication date
Mar 6, 2014
KYOTO UNIVERSITY
Yu YOSHINO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SUBSTRATE CLEANING APPARATUS AND VACUUM PROCESSING SYSTEM
Publication number
20120247670
Publication date
Oct 4, 2012
IWATANI CORPORATION
Kazuya DOBASHI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Vacuum Processing Apparatus, Vacuum Processing Method, and Micro-Ma...
Publication number
20120071003
Publication date
Mar 22, 2012
Kazuya Dobashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
CLUSTER JET PROCESSING METHOD, SEMICONDUCTOR ELEMENT, MICROELECTROM...
Publication number
20110147896
Publication date
Jun 23, 2011
IWATANI CORPORATION
Kunihiko Koike
B81 - MICRO-STRUCTURAL TECHNOLOGY