Takehiko SENOO

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Gas cluster processing device and gas cluster processing method
- Patent number 12,172,198
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Kazuya Dobashi
- B08 - CLEANING
Information Patent Grant
Cutting method of workpiece by forming reformed region and dry etch...
- Patent number 11,482,455
- Issue date Oct 25, 2022
- Iwatani Corporation
- Toshiki Manabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting method
- Patent number 11,380,586
- Issue date Jul 5, 2022
- Iwatani Corporation
- Toshiki Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas cluster processing device and gas cluster processing method
- Patent number 11,267,021
- Issue date Mar 8, 2022
- Tokyo Electron Limited
- Kazuya Dobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for supplying mixed gas
- Patent number 9,533,268
- Issue date Jan 3, 2017
- Iwatani Corporation
- Kunihiko Koike
- G05 - CONTROLLING REGULATING
Information Patent Grant
Substrate cleaning apparatus and vacuum processing system
- Patent number 9,214,364
- Issue date Dec 15, 2015
- Tokyo Electron Limited
- Kazuya Dobashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dividing method for wafer
- Patent number 9,159,622
- Issue date Oct 13, 2015
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cluster jet processing method, semiconductor element, microelectrom...
- Patent number 8,461,051
- Issue date Jun 11, 2013
- Iwatani Corporation
- Kunihiko Koike
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
GAS CLUSTER PROCESSING DEVICE AND GAS CLUSTER PROCESSING METHOD
- Publication number 20220143655
- Publication date May 12, 2022
- TOKYO ELECTRON LIMITED
- Kazuya DOBASHI
- B08 - CLEANING
Information Patent Application
Gas Cluster Processing Device and Gas Cluster Processing Method
- Publication number 20210107041
- Publication date Apr 15, 2021
- TOKYO ELECTRON LIMITED
- Kazuya DOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING METHOD
- Publication number 20200365460
- Publication date Nov 19, 2020
- IWATANI CORPORATION
- Toshiki MANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING METHOD
- Publication number 20200365461
- Publication date Nov 19, 2020
- IWATANI CORPORATION
- Toshiki MANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIVIDING METHOD FOR WAFER
- Publication number 20150044857
- Publication date Feb 12, 2015
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SUPPLYING MIXED GAS
- Publication number 20150020890
- Publication date Jan 22, 2015
- IWATANI CORPORATION
- Kunihiko KOIKE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PROCESSING METHOD UTILIZING CLUSTER
- Publication number 20140061031
- Publication date Mar 6, 2014
- KYOTO UNIVERSITY
- Yu YOSHINO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE CLEANING APPARATUS AND VACUUM PROCESSING SYSTEM
- Publication number 20120247670
- Publication date Oct 4, 2012
- IWATANI CORPORATION
- Kazuya DOBASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Vacuum Processing Apparatus, Vacuum Processing Method, and Micro-Ma...
- Publication number 20120071003
- Publication date Mar 22, 2012
- Kazuya Dobashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CLUSTER JET PROCESSING METHOD, SEMICONDUCTOR ELEMENT, MICROELECTROM...
- Publication number 20110147896
- Publication date Jun 23, 2011
- IWATANI CORPORATION
- Kunihiko Koike
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Takehiko SENOO

Person

Patents Grantslast 30 patents

Gas cluster processing device and gas cluster processing method

Cutting method of workpiece by forming reformed region and dry etch...

Cutting method

Gas cluster processing device and gas cluster processing method

Method and apparatus for supplying mixed gas

Substrate cleaning apparatus and vacuum processing system

Dividing method for wafer

Cluster jet processing method, semiconductor element, microelectrom...

Patents Applicationslast 30 patents

GAS CLUSTER PROCESSING DEVICE AND GAS CLUSTER PROCESSING METHOD

Gas Cluster Processing Device and Gas Cluster Processing Method

CUTTING METHOD

CUTTING METHOD

DIVIDING METHOD FOR WAFER

METHOD AND APPARATUS FOR SUPPLYING MIXED GAS

PROCESSING METHOD UTILIZING CLUSTER

SUBSTRATE CLEANING APPARATUS AND VACUUM PROCESSING SYSTEM

Vacuum Processing Apparatus, Vacuum Processing Method, and Micro-Ma...

CLUSTER JET PROCESSING METHOD, SEMICONDUCTOR ELEMENT, MICROELECTROM...