Takehiko Ueda

Person

Netagaya-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic apparatus activation control apparatus, electronic appar...
- Patent number 12,158,736
- Issue date Dec 3, 2024
- Saturn Licensing LLC
- Masaharu Yoshino
- G05 - CONTROLLING REGULATING
Information Patent Grant
Washing/drying apparatus, screening apparatus, washing/drying metho...
- Patent number 10,429,402
- Issue date Oct 1, 2019
- Nikon Corporation
- Tadao Isami
- B08 - CLEANING
Information Patent Grant
Method for predicting worked shape, method for determining working...
- Patent number 9,031,687
- Issue date May 12, 2015
- Nikon Corporation
- Tatsuya Senga
- B24 - GRINDING POLISHING
Information Patent Grant
Method for detecting polishing end in CMP polishing device, CMP pol...
- Patent number 7,981,309
- Issue date Jul 19, 2011
- Nikon Corporation
- Takehiko Ueda
- B24 - GRINDING POLISHING
Information Patent Grant
Working shape prediction method, working requirement determination...
- Patent number 7,686,673
- Issue date Mar 30, 2010
- Nikon Corporation
- Tatsuya Senga
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing end point detection apparatus and method
- Patent number 7,169,016
- Issue date Jan 30, 2007
- Nikon Corporation
- Andrew H. Barada
- B24 - GRINDING POLISHING
Information Patent Grant
Layer-thickness detection methods and apparatus for wafers and the...
- Patent number 7,052,920
- Issue date May 30, 2006
- Nikon Corporation
- Yoshijiro Ushio
- B24 - GRINDING POLISHING
Information Patent Grant
Process end point detection apparatus and method, polishing apparat...
- Patent number 6,963,407
- Issue date Nov 8, 2005
- Nikon Corporation
- Hiroyuki Abe
- B24 - GRINDING POLISHING
Information Patent Grant
Layer-thickness detection methods and apparatus for wafers and the...
- Patent number 6,670,200
- Issue date Dec 30, 2003
- Nikon Corporation
- Yoshijiro Ushio
- B24 - GRINDING POLISHING
Information Patent Grant
Display device and camera having the display device
- Patent number 6,556,179
- Issue date Apr 29, 2003
- Nikon Corporation
- Toru Iwane
- G02 - OPTICS
Information Patent Grant
Apparatus and methods for detecting thickness of a patterned layer
- Patent number 6,489,624
- Issue date Dec 3, 2002
- Nikon Corporation
- Yoshijiro Ushio
- G01 - MEASURING TESTING
Information Patent Grant
Layer-thickness detection methods and apparatus for wafers and the...
- Patent number 6,271,047
- Issue date Aug 7, 2001
- Nikon Corporation
- Yoshijiro Ushio
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacture of liquid crystal display device having chara...
- Patent number 6,051,444
- Issue date Apr 18, 2000
- Nikon Corporation
- Toshimi Watanabe
- G02 - OPTICS
Information Patent Grant
Photographic recording apparatus
- Patent number 5,933,181
- Issue date Aug 3, 1999
- Futaba Denshi Kogyo K.K.
- Yukihiko Shimizu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Controlling apparatus for high frequency high voltage power source...
- Patent number 5,486,993
- Issue date Jan 23, 1996
- Kasuga Denki, Incorporated
- Yukihira Sakurai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ANALYSIS SYSTEM, OBSERVATION CONTAINER, ANALYSIS METHOD, AND PROGRAM
- Publication number 20240273716
- Publication date Aug 15, 2024
- Nikon Corporation
- Takehiko UEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Apparatus Activation Control Apparatus, Electronic Appar...
- Publication number 20190384241
- Publication date Dec 19, 2019
- Saturn Licensing LLC
- Masaharu Yoshino
- G05 - CONTROLLING REGULATING
Information Patent Application
WASHING/DRYING APPARATUS, SCREENING APPARATUS, WASHING/DRYING METHO...
- Publication number 20170045543
- Publication date Feb 16, 2017
- Nikon Corporation
- Tadao ISAMI
- G01 - MEASURING TESTING
Information Patent Application
BIOCHIP FIXING METHOD, BIOCHIP FIXING DEVICE, AND SCREENING METHOD...
- Publication number 20160059201
- Publication date Mar 3, 2016
- Nikon Corporation
- Takehiko UEDA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ELECTRONIC APPARATUS ACTIVATION CONTROL APPARATUS, ELECTRONIC APPAR...
- Publication number 20140058536
- Publication date Feb 27, 2014
- SONY CORPORATION
- Masaharu Yoshino
- G05 - CONTROLLING REGULATING
Information Patent Application
OPTICAL ELEMENT, OPTICAL DEVICE, MEASUREMENT DEVICE, AND SCREENING...
- Publication number 20140027653
- Publication date Jan 30, 2014
- Nikon Corporation
- Susumu MORI
- G02 - OPTICS
Information Patent Application
METHOD FOR PREDICTING WORKED SHAPE, METHOD FOR DETERMINING WORKING...
- Publication number 20100233937
- Publication date Sep 16, 2010
- Tatsuya Senga
- B24 - GRINDING POLISHING
Information Patent Application
Method for Detecting Polishing End in CMP Polishing Device, CMP Pol...
- Publication number 20090233525
- Publication date Sep 17, 2009
- Takehiko Ueda
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING END POINT DETECTION APPARATUS AND METHOD
- Publication number 20060258263
- Publication date Nov 16, 2006
- Nikon Corporation
- Andrew H. Barada
- B24 - GRINDING POLISHING
Information Patent Application
Working shape prediction method, working requirement determination...
- Publication number 20040053558
- Publication date Mar 18, 2004
- Tatsuya Senga
- B24 - GRINDING POLISHING
Information Patent Application
Process end point detection apparatus and method, polishing apparat...
- Publication number 20030205664
- Publication date Nov 6, 2003
- Hiroyuki Abe
- B24 - GRINDING POLISHING
Information Patent Application
Layer-thickness detection methods and apparatus for wafers and the...
- Publication number 20020001862
- Publication date Jan 3, 2002
- NIKON CORPORATION
- Yoshijiro Ushio
- G01 - MEASURING TESTING
Information Patent Application
Layer-thickness detection methods and apparatus for wafers and the...
- Publication number 20010039064
- Publication date Nov 8, 2001
- NIKON CORPORATION
- Yoshijiro Ushio
- G01 - MEASURING TESTING
Information Patent Application
DISPLAY DEVICE AND CAMERA HAVING THE DISPLAY DEVICE
- Publication number 20010011966
- Publication date Aug 9, 2001
- TORU IWANE
- G02 - OPTICS

Takehiko Ueda

Person

Patents Grantslast 30 patents

Electronic apparatus activation control apparatus, electronic appar...

Washing/drying apparatus, screening apparatus, washing/drying metho...

Method for predicting worked shape, method for determining working...

Method for detecting polishing end in CMP polishing device, CMP pol...

Working shape prediction method, working requirement determination...

Chemical mechanical polishing end point detection apparatus and method

Layer-thickness detection methods and apparatus for wafers and the...

Process end point detection apparatus and method, polishing apparat...

Layer-thickness detection methods and apparatus for wafers and the...

Display device and camera having the display device

Apparatus and methods for detecting thickness of a patterned layer

Layer-thickness detection methods and apparatus for wafers and the...

Method of manufacture of liquid crystal display device having chara...

Photographic recording apparatus

Controlling apparatus for high frequency high voltage power source...

Patents Applicationslast 30 patents

ANALYSIS SYSTEM, OBSERVATION CONTAINER, ANALYSIS METHOD, AND PROGRAM

Electronic Apparatus Activation Control Apparatus, Electronic Appar...

WASHING/DRYING APPARATUS, SCREENING APPARATUS, WASHING/DRYING METHO...

BIOCHIP FIXING METHOD, BIOCHIP FIXING DEVICE, AND SCREENING METHOD...

ELECTRONIC APPARATUS ACTIVATION CONTROL APPARATUS, ELECTRONIC APPAR...

OPTICAL ELEMENT, OPTICAL DEVICE, MEASUREMENT DEVICE, AND SCREENING...

METHOD FOR PREDICTING WORKED SHAPE, METHOD FOR DETERMINING WORKING...

Method for Detecting Polishing End in CMP Polishing Device, CMP Pol...

CHEMICAL MECHANICAL POLISHING END POINT DETECTION APPARATUS AND METHOD

Working shape prediction method, working requirement determination...

Process end point detection apparatus and method, polishing apparat...

Layer-thickness detection methods and apparatus for wafers and the...

Layer-thickness detection methods and apparatus for wafers and the...

DISPLAY DEVICE AND CAMERA HAVING THE DISPLAY DEVICE