Takehito MOCHIZUKI

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Kumagaya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Die bonder and bonding method
- Patent number 10,096,526
- Issue date Oct 9, 2018
- FASFORD TECHNOLOGY CO., LTD.
- Masayuki Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and bonding method
- Patent number 8,991,681
- Issue date Mar 31, 2015
- Hitachi High-Tech Instuments Co., Ltd.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068824
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Masayuki MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068823
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068826
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS