TREA

Takehito Terasawa

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  • Nagano-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring substrate and semiconductor device
    • Patent number 9,799,596
    • Issue date Oct 24, 2017
    • Shinko Electric Industries Co., Ltd.
    • Ryo Fukasawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrate having leads
    • Patent number 8,735,737
    • Issue date May 27, 2014
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Ihara
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    • Publication number 20170229388
    • Publication date Aug 10, 2017
    • Shinko Electric Industries Co., Ltd.
    • RYO FUKASAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE HAVING LEADS
    • Publication number 20100300742
    • Publication date Dec 2, 2010
    • Shinko Electric Industries Co., Ltd.
    • Yoshihiro Ihara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR