Takehito Tsukamoto

Person

Tokorozawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,672,928
- Issue date Jun 2, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,056,517
- Issue date Aug 21, 2018
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, its manufacturing method, and semiconductor light emitt...
- Patent number 8,841,692
- Issue date Sep 23, 2014
- Toppan Printing Co., Ltd.
- Osamu Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-containing curable composition, cured product of the silico...
- Patent number 8,809,478
- Issue date Aug 19, 2014
- Adeka Corporation
- Masako Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Manufacturing method of lead frame substrate
- Patent number 8,703,598
- Issue date Apr 22, 2014
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame substrate and method of manufacturing the same, and semi...
- Patent number 8,558,363
- Issue date Oct 15, 2013
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of lead frame substrate and semiconductor appa...
- Patent number 8,546,940
- Issue date Oct 1, 2013
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate for semiconductor element, and se...
- Patent number 8,535,987
- Issue date Sep 17, 2013
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing substrate for semiconductor element
- Patent number 8,535,979
- Issue date Sep 17, 2013
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing substrate for semiconductor element, and s...
- Patent number 8,466,547
- Issue date Jun 18, 2013
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame substrate, manufacturing method thereof, and semiconduct...
- Patent number 8,390,105
- Issue date Mar 5, 2013
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor element, method for manufacturing subst...
- Patent number 8,319,322
- Issue date Nov 27, 2012
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame substrate and method of manufacturing the same
- Patent number 8,304,294
- Issue date Nov 6, 2012
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-layer wiring board
- Patent number 7,584,535
- Issue date Sep 8, 2009
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical waveguide and method of manufacturing the same
- Patent number 7,289,713
- Issue date Oct 30, 2007
- Toppan Printing Co., Ltd.
- Mamoru Ishizaki
- G02 - OPTICS
Information Patent Grant
Optical waveguide and method of manufacturing the same
- Patent number 7,050,691
- Issue date May 23, 2006
- Toppan Printing Co., Ltd.
- Mamoru Ishizaki
- G02 - OPTICS
Information Patent Grant
Optical-electrical wiring board, mounted board and method of manufa...
- Patent number 6,804,423
- Issue date Oct 12, 2004
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical-electric printed wiring board, printed circuit board, and m...
- Patent number 6,739,761
- Issue date May 25, 2004
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical wiring layer, optoelectric wiring substrate, mounted substr...
- Patent number 6,438,281
- Issue date Aug 20, 2002
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20170358700
- Publication date Dec 14, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20140090698
- Publication date Apr 3, 2014
- Toppan Printing Co., Ltd.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE
- Publication number 20140021162
- Publication date Jan 23, 2014
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT
- Publication number 20130112652
- Publication date May 9, 2013
- Toppan Printing Co., Ltd.
- Junko TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICO...
- Publication number 20130075154
- Publication date Mar 28, 2013
- ADEKA CORPORATION
- Masako Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...
- Publication number 20120061809
- Publication date Mar 15, 2012
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...
- Publication number 20120061829
- Publication date Mar 15, 2012
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...
- Publication number 20120018860
- Publication date Jan 26, 2012
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SUBST...
- Publication number 20120018867
- Publication date Jan 26, 2012
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE AND SEMICONDUCTOR APPA...
- Publication number 20110169145
- Publication date Jul 14, 2011
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame substrate and method of manufacturing the same
- Publication number 20110169153
- Publication date Jul 14, 2011
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20110163433
- Publication date Jul 7, 2011
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame substrate and method of manufacturing the same, and semi...
- Publication number 20110163435
- Publication date Jul 7, 2011
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, its manufacturing method, and semiconductor light emitt...
- Publication number 20110133232
- Publication date Jun 9, 2011
- Toppan Printing Co., Ltd.
- Osamu Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multi-layer wiring board
- Publication number 20070175025
- Publication date Aug 2, 2007
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical waveguide and method of manufacturing the same
- Publication number 20060177188
- Publication date Aug 10, 2006
- Toppan Printing Co., Ltd.
- Mamoru Ishizaki
- G02 - OPTICS
Information Patent Application
Optical waveguide and method of manufacturing the same
- Publication number 20040234224
- Publication date Nov 25, 2004
- Toppan Printing Co., Ltd.
- Mamoru Ishizaki
- G02 - OPTICS
Information Patent Application
Multi-layer wiring board, IC package, and method of manufacturing m...
- Publication number 20040178492
- Publication date Sep 16, 2004
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical-electric printed wiring board, printed circuit board, and m...
- Publication number 20020061154
- Publication date May 23, 2002
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- G02 - OPTICS
Information Patent Application
Optical-electrical wiring board, mounted board and method of manufa...
- Publication number 20020051599
- Publication date May 2, 2002
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- G02 - OPTICS

Takehito Tsukamoto

Person

Patents Grantslast 30 patents

Metal foil pattern layered body, metal foil layered body, metal foi...

Metal foil pattern layered body, metal foil layered body, metal foi...

Lead frame, its manufacturing method, and semiconductor light emitt...

Silicon-containing curable composition, cured product of the silico...

Manufacturing method of lead frame substrate

Lead frame substrate and method of manufacturing the same, and semi...

Manufacturing method of lead frame substrate and semiconductor appa...

Method of manufacturing substrate for semiconductor element, and se...

Method for manufacturing substrate for semiconductor element

Method for manufacturing substrate for semiconductor element, and s...

Lead frame substrate, manufacturing method thereof, and semiconduct...

Substrate for semiconductor element, method for manufacturing subst...

Lead frame substrate and method of manufacturing the same

Method of manufacturing multi-layer wiring board

Optical waveguide and method of manufacturing the same

Optical waveguide and method of manufacturing the same

Optical-electrical wiring board, mounted board and method of manufa...

Optical-electric printed wiring board, printed circuit board, and m...

Optical wiring layer, optoelectric wiring substrate, mounted substr...

Patents Applicationslast 30 patents

METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...

METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...

MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT

SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICO...

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...

SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SUBST...

MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE AND SEMICONDUCTOR APPA...

Lead frame substrate and method of manufacturing the same

LEAD FRAME SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...

Lead frame substrate and method of manufacturing the same, and semi...

Lead frame, its manufacturing method, and semiconductor light emitt...

Method of manufacturing multi-layer wiring board

Optical waveguide and method of manufacturing the same

Optical waveguide and method of manufacturing the same

Multi-layer wiring board, IC package, and method of manufacturing m...

Optical-electric printed wiring board, printed circuit board, and m...

Optical-electrical wiring board, mounted board and method of manufa...