Takekazu Sakai

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing circuit board
- Patent number 9,078,382
- Issue date Jul 7, 2015
- Show A Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for adhering solder powder and method for adhering solder...
- Patent number 8,752,754
- Issue date Jun 17, 2014
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuit board
- Patent number 8,661,659
- Issue date Mar 4, 2014
- Showa Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of solder circuit board
- Patent number 8,123,111
- Issue date Feb 28, 2012
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for attachment of solder powder to electronic circuit board...
- Patent number 8,109,432
- Issue date Feb 7, 2012
- Showa Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of electronic circuit board
- Patent number 8,038,051
- Issue date Oct 18, 2011
- Showa Denko K.K.
- Takekazu Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing conductive circuit board
- Patent number 7,775,417
- Issue date Aug 17, 2010
- Showda Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder circuit
- Patent number 6,476,487
- Issue date Nov 5, 2002
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating solder-bearing silicon semiconductor device a...
- Patent number 6,221,692
- Issue date Apr 24, 2001
- Showa Denko, K.K.
- Takashi Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon semiconductor device,electrode structure therefor, and circ...
- Patent number 5,982,629
- Issue date Nov 9, 1999
- Showa Denko K.K.
- Takashi Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder film
- Patent number 5,928,440
- Issue date Jul 27, 1999
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder film
- Patent number 5,750,271
- Issue date May 12, 1998
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solution for selectively imparting tackiness to a metallic surface
- Patent number 5,713,997
- Issue date Feb 3, 1998
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder film
- Patent number 5,556,023
- Issue date Sep 17, 1996
- Showa Denko K.K.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SOLDER CIRCUIT BOARD, SOLDER CIRCUIT BOARD...
- Publication number 20160219721
- Publication date Jul 28, 2016
- SHOWA DENKO K.K.
- Takekazu SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER...
- Publication number 20120292377
- Publication date Nov 22, 2012
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20120042511
- Publication date Feb 23, 2012
- Showa Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20120042515
- Publication date Feb 23, 2012
- Showa Denko K.K.
- Takashi Shoji
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD
- Publication number 20100065615
- Publication date Mar 18, 2010
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD
- Publication number 20100038411
- Publication date Feb 18, 2010
- Showa Denko K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY...
- Publication number 20100009070
- Publication date Jan 14, 2010
- SHOWA DENKO K.K
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF SOLDER CIRCUIT BOARD
- Publication number 20090261148
- Publication date Oct 22, 2009
- SHOWA DENKO K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF SOLDER CIRCUIT BOARD
- Publication number 20090056977
- Publication date Mar 5, 2009
- SHOWA DENKOK.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD...
- Publication number 20090041990
- Publication date Feb 12, 2009
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Attachment of Solder Powder to Electronic Circuit Board...
- Publication number 20080173699
- Publication date Jul 24, 2008
- SHOWA DENKO K.K.
- Takashi Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Production of Electronic Circuit Board
- Publication number 20070284136
- Publication date Dec 13, 2007
- Takekazu Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder circuit
- Publication number 20010020744
- Publication date Sep 13, 2001
- Takeo Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Takekazu Sakai

Person

Patents Grantslast 30 patents

Method of producing circuit board

Apparatus for adhering solder powder and method for adhering solder...

Method of producing circuit board

Production method of solder circuit board

Method for attachment of solder powder to electronic circuit board...

Method for production of electronic circuit board

Method of producing conductive circuit board

Solder circuit

Method of fabricating solder-bearing silicon semiconductor device a...

Silicon semiconductor device,electrode structure therefor, and circ...

Method of forming solder film

Method of forming solder film

Solution for selectively imparting tackiness to a metallic surface

Method of forming solder film

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SOLDER CIRCUIT BOARD, SOLDER CIRCUIT BOARD...

APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER...

METHOD OF PRODUCING CIRCUIT BOARD

METHOD OF PRODUCING CIRCUIT BOARD

METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD

METHOD OF PRODUCING CONDUCTIVE CIRCUIT BOARD

METHOD FOR FORMING SOLDER LAYER ON PRINTED-WIRING BOARD AND SLURRY...

PRODUCTION METHOD OF SOLDER CIRCUIT BOARD

PRODUCTION METHOD OF SOLDER CIRCUIT BOARD

METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD...

Method for Attachment of Solder Powder to Electronic Circuit Board...

Method for Production of Electronic Circuit Board

Solder circuit