Takekazu Tanaka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,395,261
- Issue date Mar 12, 2013
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including coupling ball with layers of aluminu...
- Patent number 8,334,596
- Issue date Dec 18, 2012
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with welded leads and method of manufacturing...
- Patent number 8,299,620
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,944,052
- Issue date May 17, 2011
- Renesas Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor apparatus
- Patent number 7,820,489
- Issue date Oct 26, 2010
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a coupling region which includes lay...
- Patent number 7,791,198
- Issue date Sep 7, 2010
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus manufacturing method
- Patent number 7,772,031
- Issue date Aug 10, 2010
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,723,837
- Issue date May 25, 2010
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and semiconductor device using the same
- Patent number 7,550,829
- Issue date Jun 23, 2009
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production process for manufacturing such semiconductor package
- Patent number 7,449,370
- Issue date Nov 11, 2008
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and semiconductor device using the same
- Patent number 7,274,090
- Issue date Sep 25, 2007
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless type semiconductor package, and production process for man...
- Patent number 7,224,045
- Issue date May 29, 2007
- NEC Electronics Corporation
- Yukinori Tabira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, semiconductor device using the same and method of produ...
- Patent number 7,189,599
- Issue date Mar 13, 2007
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having encapsulated chip attached to a mounti...
- Patent number 7,138,673
- Issue date Nov 21, 2006
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120306077
- Publication date Dec 6, 2012
- RENESAS ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20110241204
- Publication date Oct 6, 2011
- RENESAS ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110062585
- Publication date Mar 17, 2011
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WELDED LEADS AND METHOD OF MANUFACTURING...
- Publication number 20090008775
- Publication date Jan 8, 2009
- NEC Electronics Corporation
- Takekazu TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080203568
- Publication date Aug 28, 2008
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package and semiconductor device using the same
- Publication number 20080001265
- Publication date Jan 3, 2008
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor apparatus
- Publication number 20070249152
- Publication date Oct 25, 2007
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus manufacturing method
- Publication number 20070172980
- Publication date Jul 26, 2007
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production process for manufacturing such semiconductor package
- Publication number 20070090499
- Publication date Apr 26, 2007
- NEC ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060170113
- Publication date Aug 3, 2006
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package and semiconductor device using the same
- Publication number 20060001135
- Publication date Jan 5, 2006
- NEC Electronics Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, semiconductor device using the same and method of produ...
- Publication number 20050032271
- Publication date Feb 10, 2005
- NEC ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless type semiconductor package, and production process for man...
- Publication number 20050023658
- Publication date Feb 3, 2005
- NEC Electronics Corporation
- Yukinori Tabira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, and production process for manufacturing suc...
- Publication number 20040082109
- Publication date Apr 29, 2004
- NEC ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, semiconductor device using the same and method of produ...
- Publication number 20020180011
- Publication date Dec 5, 2002
- NEC Corporation
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Takekazu Tanaka

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device including coupling ball with layers of aluminu...

Semiconductor device with welded leads and method of manufacturing...

Semiconductor device

Method of manufacturing semiconductor apparatus

Semiconductor device including a coupling region which includes lay...

Semiconductor apparatus manufacturing method

Semiconductor device

Electronic package and semiconductor device using the same

Production process for manufacturing such semiconductor package

Electronic package and semiconductor device using the same

Leadless type semiconductor package, and production process for man...

Lead frame, semiconductor device using the same and method of produ...

Semiconductor package having encapsulated chip attached to a mounti...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Semiconductor device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH WELDED LEADS AND METHOD OF MANUFACTURING...

Semiconductor device

Electronic package and semiconductor device using the same

Method of manufacturing semiconductor apparatus

Semiconductor apparatus manufacturing method

Production process for manufacturing such semiconductor package

Semiconductor device

Electronic package and semiconductor device using the same

Lead frame, semiconductor device using the same and method of produ...

Leadless type semiconductor package, and production process for man...

Semiconductor package, and production process for manufacturing suc...

Lead frame, semiconductor device using the same and method of produ...