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Takenori SUZUKI
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Room-temperature-bonded semiconductor device and manufacturing meth...
Patent number
10,486,263
Issue date
Nov 26, 2019
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Jun Utsumi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Room temperature bonding apparatus and room temperature bonding method
Patent number
9,580,306
Issue date
Feb 28, 2017
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Masato Kinouchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Room-temperature bonding apparatus
Patent number
9,443,711
Issue date
Sep 13, 2016
Mitsubishi Heavy Industries Machine Tool Co., Ltd.
Masato Kinouchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer bonding device and wafer bonding method
Patent number
9,130,000
Issue date
Sep 8, 2015
Mitsubishi Heavy Industries
Takeshi Tsuno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding unit control unit and multi-layer bonding method
Patent number
9,064,910
Issue date
Jun 23, 2015
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bonding unit control unit and multi-layer bonding method
Patent number
9,023,170
Issue date
May 5, 2015
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Room temperature bonding apparatus
Patent number
9,005,390
Issue date
Apr 14, 2015
Mitsubishi Heavy Industries, Ltd.
Takeshi Tsuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Room temperature bonding machine and room temperature bonding method
Patent number
8,985,175
Issue date
Mar 24, 2015
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Room temperature bonding apparatus
Patent number
8,906,175
Issue date
Dec 9, 2014
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Room temperature bonding apparatus
Patent number
8,857,487
Issue date
Oct 14, 2014
Mitsubishi Heavy Industries, Ltd.
Takeshi Tsuno
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE JOINING METHOD
Publication number
20190172813
Publication date
Jun 6, 2019
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Jun UTSUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20170355040
Publication date
Dec 14, 2017
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Jun UTSUMI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
Publication number
20170162428
Publication date
Jun 8, 2017
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Masato KINOUCHI
B32 - LAYERED PRODUCTS
Information
Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
Publication number
20150251904
Publication date
Sep 10, 2015
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD
Publication number
20150249026
Publication date
Sep 3, 2015
Mitsubishi Heavy Industries, Ltd.
Takeshi Tsuno
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
Publication number
20140224405
Publication date
Aug 14, 2014
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Room Temperature Bonding Apparatus
Publication number
20120285624
Publication date
Nov 15, 2012
Takeshi Tsuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
Publication number
20120247645
Publication date
Oct 4, 2012
MITSUBISHI HEAVY INDUSTIRIES, LTD.
Keiichiro Tsutsumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD
Publication number
20120031557
Publication date
Feb 9, 2012
Mitsubishi Heavy Industries, Ltd.,
Masato Kinouchi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ROOM TEMPERATURE BONDING APPARATUS
Publication number
20110277904
Publication date
Nov 17, 2011
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
Publication number
20110207291
Publication date
Aug 25, 2011
Mitsubishi Heavy Industries, Ltd.,
Takeshi Tsuno
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD
Publication number
20110083801
Publication date
Apr 14, 2011
Mitsubishi Heavy Industries, Ltd.
Masato Kinouchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ROOM TEMPERATURE BONDING APPARATUS
Publication number
20110011536
Publication date
Jan 20, 2011
Takeshi Tsuno
H01 - BASIC ELECTRIC ELEMENTS