Takenori SUZUKI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Room-temperature-bonded semiconductor device and manufacturing meth...
- Patent number 10,486,263
- Issue date Nov 26, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus and room temperature bonding method
- Patent number 9,580,306
- Issue date Feb 28, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room-temperature bonding apparatus
- Patent number 9,443,711
- Issue date Sep 13, 2016
- Mitsubishi Heavy Industries Machine Tool Co., Ltd.
- Masato Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding device and wafer bonding method
- Patent number 9,130,000
- Issue date Sep 8, 2015
- Mitsubishi Heavy Industries
- Takeshi Tsuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding unit control unit and multi-layer bonding method
- Patent number 9,064,910
- Issue date Jun 23, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding unit control unit and multi-layer bonding method
- Patent number 9,023,170
- Issue date May 5, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature bonding apparatus
- Patent number 9,005,390
- Issue date Apr 14, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature bonding machine and room temperature bonding method
- Patent number 8,985,175
- Issue date Mar 24, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus
- Patent number 8,906,175
- Issue date Dec 9, 2014
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus
- Patent number 8,857,487
- Issue date Oct 14, 2014
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE JOINING METHOD
- Publication number 20190172813
- Publication date Jun 6, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20170355040
- Publication date Dec 14, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Jun UTSUMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20170162428
- Publication date Jun 8, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato KINOUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20150251904
- Publication date Sep 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD
- Publication number 20150249026
- Publication date Sep 3, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20140224405
- Publication date Aug 14, 2014
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Room Temperature Bonding Apparatus
- Publication number 20120285624
- Publication date Nov 15, 2012
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
- Publication number 20120247645
- Publication date Oct 4, 2012
- MITSUBISHI HEAVY INDUSTIRIES, LTD.
- Keiichiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD
- Publication number 20120031557
- Publication date Feb 9, 2012
- Mitsubishi Heavy Industries, Ltd.,
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS
- Publication number 20110277904
- Publication date Nov 17, 2011
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20110207291
- Publication date Aug 25, 2011
- Mitsubishi Heavy Industries, Ltd.,
- Takeshi Tsuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20110083801
- Publication date Apr 14, 2011
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS
- Publication number 20110011536
- Publication date Jan 20, 2011
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS

Takenori SUZUKI

Person

Patents Grantslast 30 patents

Room-temperature-bonded semiconductor device and manufacturing meth...

Room temperature bonding apparatus and room temperature bonding method

Room-temperature bonding apparatus

Wafer bonding device and wafer bonding method

Bonding unit control unit and multi-layer bonding method

Bonding unit control unit and multi-layer bonding method

Room temperature bonding apparatus

Room temperature bonding machine and room temperature bonding method

Room temperature bonding apparatus

Room temperature bonding apparatus

Patents Applicationslast 30 patents

SUBSTRATE JOINING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ROOM-TEMPERATURE BONDING APPARATUS

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD

ROOM-TEMPERATURE BONDING APPARATUS

Room Temperature Bonding Apparatus

BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD

ROOM TEMPERATURE BONDING APPARATUS

WAFER BONDING DEVICE AND WAFER BONDING METHOD

ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD

ROOM TEMPERATURE BONDING APPARATUS