Takenori YANAI

Person

Ageo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate sheet and method of use thereof
- Patent number 11,961,771
- Issue date Apr 16, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil with carrier
- Patent number 11,765,840
- Issue date Sep 19, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil with glass carrier and production method therefor
- Patent number 11,756,845
- Issue date Sep 12, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Carrier-containing metal foil and method for manufacturing millimet...
- Patent number 11,637,358
- Issue date Apr 25, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Mikiko Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,527,415
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,525,073
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for multilayer wiring board
- Patent number 10,840,180
- Issue date Nov 17, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD
- Publication number 20250065617
- Publication date Feb 27, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Takenori YANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD
- Publication number 20230420270
- Publication date Dec 28, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY
- Publication number 20220022326
- Publication date Jan 20, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
CARRIER-CONTAINING METAL FOIL AND METHOD FOR MANUFACTURING MILLIMET...
- Publication number 20210328325
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Mikiko KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE SHEET AND METHOD OF USE THEREOF
- Publication number 20210313237
- Publication date Oct 7, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FOIL WITH CARRIER
- Publication number 20210059057
- Publication date Feb 25, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH GLASS CARRIER AND PRODUCTION METHOD THEREFOR
- Publication number 20200411396
- Publication date Dec 31, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045830
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045829
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20190378728
- Publication date Dec 12, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20190378727
- Publication date Dec 12, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS

Takenori YANAI

Person

Patents Grantslast 30 patents

Multilayer body

Laminate sheet and method of use thereof

Copper foil with carrier

Copper foil with glass carrier and production method therefor

Carrier-containing metal foil and method for manufacturing millimet...

Multilayer circuit board manufacturing method

Multilayer circuit board manufacturing method

Production method for multilayer wiring board

Patents Applicationslast 30 patents

SHEET FIXING DEVICE, SHEET PEELING DEVICE, AND SHEET PEELING METHOD

METHOD FOR PRODUCING WIRING BOARD

MULTILAYER BODY

CARRIER-CONTAINING METAL FOIL AND METHOD FOR MANUFACTURING MILLIMET...

LAMINATE SHEET AND METHOD OF USE THEREOF

COPPER FOIL WITH CARRIER

COPPER FOIL WITH GLASS CARRIER AND PRODUCTION METHOD THEREFOR

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD

MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD