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Takeo Kanazawa
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Nagano, JP
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last 30 patents
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Patent Grant
Method of forming bumps by electroplating
Patent number
6,413,404
Issue date
Jul 2, 2002
Shinko Electric Industries Co., Ltd.
Yoshihiro Ihara
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Patent Grant
Device for forming bumps by metal plating
Patent number
6,030,512
Issue date
Feb 29, 2000
Shinko Electric Industries, Co. Ltd.
Yoshihiro Ihara
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR