Takeo Kuramoto

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder precoating method and workpiece for electronic equipment
- Patent number 9,821,397
- Issue date Nov 21, 2017
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump formation on a circuit board using a transfer sheet
- Patent number 8,701,973
- Issue date Apr 22, 2014
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball assembly for bump formation and method for its manufacture
- Patent number 7,112,888
- Issue date Sep 26, 2006
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball assembly, a method for its manufacture, and a method of...
- Patent number 6,919,634
- Issue date Jul 19, 2005
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treating agent
- Patent number 4,478,885
- Issue date Oct 23, 1984
- W. R. Grace K.K.
- Takeo Kuramoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
- Publication number 20110297433
- Publication date Dec 8, 2011
- SENJU METAL INDUSTRY CO., LTD.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Precoating Method and Workpiece For Electronic Equipment
- Publication number 20080213613
- Publication date Sep 4, 2008
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball assembly for bump formation and method for its manufacture
- Publication number 20040145064
- Publication date Jul 29, 2004
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball assembly, a method for its manufacture, and a method of...
- Publication number 20040070084
- Publication date Apr 15, 2004
- Takeo Kuramoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR