Takeo Okabe

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing steering shaft
- Patent number 12,109,608
- Issue date Oct 8, 2024
- Hitachi Astemo, Ltd.
- Takateru Seki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy sputtering target and semiconductor element wiring
- Patent number 10,665,462
- Issue date May 26, 2020
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten sintered compact sputtering target and tungsten film forme...
- Patent number 10,047,433
- Issue date Aug 14, 2018
- JX Nippon Mining & Metals Corporation
- Kazumasa Ohashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy sputtering target and method for manufacturing the target
- Patent number 9,896,745
- Issue date Feb 20, 2018
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tungsten sintered compact sputtering target and method for producin...
- Patent number 9,812,301
- Issue date Nov 7, 2017
- JX Nippon Mining & Metals Corporation
- Kazumasa Ohashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High-purity copper sputtering target
- Patent number 9,773,651
- Issue date Sep 26, 2017
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy sputtering target, process for producing the same and...
- Patent number 9,765,425
- Issue date Sep 19, 2017
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sputtering target and manufacturing method therefor
- Patent number 9,704,695
- Issue date Jul 11, 2017
- JX Nippon Mining & Metals Corporation
- Kenichi Nagata
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Titanium target for sputtering
- Patent number 9,530,628
- Issue date Dec 27, 2016
- JX Nippon Mining & Metals Corporation
- Nobuhito Makino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper or copper alloy target/copper alloy backing plate assembly
- Patent number 9,472,383
- Issue date Oct 18, 2016
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High purity copper—manganese alloy sputtering target
- Patent number 9,165,750
- Issue date Oct 20, 2015
- JX Nippon Mining & Metals Corporation
- Kenichi Nagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High-purity copper-manganese-alloy sputtering target
- Patent number 9,090,970
- Issue date Jul 28, 2015
- JX Nippon Mining & Metals Corporation
- Kenichi Nagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target
- Patent number 8,262,816
- Issue date Sep 11, 2012
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper plating method, phosphorous copper anode for el...
- Patent number 8,252,157
- Issue date Aug 28, 2012
- JX Nippon Mining & Metals Corporation
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy sputtering target and semiconductor element wiring
- Patent number 8,246,764
- Issue date Aug 21, 2012
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target
- Patent number 8,241,438
- Issue date Aug 14, 2012
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target and process for producing the same
- Patent number 8,062,440
- Issue date Nov 22, 2011
- JX Nippon Mining & Metals Corporation
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,943,033
- Issue date May 17, 2011
- JX Nippon Mining & Metals Corporation
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,799,188
- Issue date Sep 21, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Packaging device and packaging method for hollow cathode type sputt...
- Patent number 7,788,882
- Issue date Sep 7, 2010
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Copper alloy sputtering target process for producing the same and s...
- Patent number 7,740,721
- Issue date Jun 22, 2010
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating method, pure copper anode for copper electrop...
- Patent number 7,648,621
- Issue date Jan 19, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy sputtering target and semiconductor element wiring
- Patent number 7,507,304
- Issue date Mar 24, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Hafnium alloy target and process for producing the same
- Patent number 7,459,036
- Issue date Dec 2, 2008
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper plating method, phosphorus-containing anode for...
- Patent number 7,374,651
- Issue date May 20, 2008
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating method, phosphorous copper anode for el...
- Patent number 7,138,040
- Issue date Nov 21, 2006
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sputtering target producing few particles
- Patent number 6,875,325
- Issue date Apr 5, 2005
- Nikko Materials Company Limited
- Hirohito Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering target producing few particles, backing plate or sputter...
- Patent number 6,858,116
- Issue date Feb 22, 2005
- Nikko Materials Company, Limited
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tantalum or tungsten target-copper alloy backing plate assembly and...
- Patent number 6,759,143
- Issue date Jul 6, 2004
- Nikko Materials Company, Limited
- Kunihiro Oda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING STEERING SHAFT
- Publication number 20220280995
- Publication date Sep 8, 2022
- Hitachi Astemo, Ltd.
- Takateru SEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sputtering Target and Method for Producing Same
- Publication number 20220049346
- Publication date Feb 17, 2022
- JX NIPPON MINING & METALS CORPORATION
- Daiki Shono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Target and Method for Producing Same
- Publication number 20220033960
- Publication date Feb 3, 2022
- JX NIPPON MINING & METALS CORPORATION
- Daiki Shono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tungsten Silicide Target Member And Method For Manufacturing Same,...
- Publication number 20210025049
- Publication date Jan 28, 2021
- JX Nippon Mining & Metals Corporation
- Takafumi Dasai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...
- Publication number 20180347031
- Publication date Dec 6, 2018
- JX NIPPON MINING & METALS CORPORATION
- Kazumasa Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Alloy Sputtering Target and Semiconductor Element Wiring
- Publication number 20180211841
- Publication date Jul 26, 2018
- JX NIPPON MINING & METALS CORPORATION
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TUNGSTEN SINTERED COMPACT SPUTTERING TARGET AND METHOD FOR PRODUCIN...
- Publication number 20150357170
- Publication date Dec 10, 2015
- JX NIPPON MINING & METALS CORPORATION
- Kazumasa Ohashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Sputtering Target
- Publication number 20150197848
- Publication date Jul 16, 2015
- JX NIPPON MINING & METALS CORPORATION
- Ryo Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...
- Publication number 20150023837
- Publication date Jan 22, 2015
- JX NIPPON MINING & METALS CORPORATION
- Kazumasa Ohashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
High-Purity Copper Sputtering Target
- Publication number 20140367253
- Publication date Dec 18, 2014
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET AND MANUFACTURING METHOD THEREFOR
- Publication number 20140318953
- Publication date Oct 30, 2014
- JX NIPPON MINING & METALS CORPORATION
- Kenichi Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High Purity Copper-Manganese Alloy Sputtering Target
- Publication number 20140284211
- Publication date Sep 25, 2014
- Kenichi Nagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH-PURITY COPPER-MANGANESE-ALLOY SPUTTERING TARGET
- Publication number 20140158532
- Publication date Jun 12, 2014
- JX NIPPON MINING & METALS CORPORATION
- Kenichi Nagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
High-Purity Copper-Manganese-Alloy Sputtering Target
- Publication number 20140097084
- Publication date Apr 10, 2014
- JX NIPPON MINING & METALS CORPORATION
- Kenichi Nagata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Titanium Target for Sputtering
- Publication number 20140027277
- Publication date Jan 30, 2014
- JX NIPPON MINING & METALS CORPORATION
- Nobuhito Makino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100307923
- Publication date Dec 9, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Alloy Sputtering Target, Process for Producing the Same and...
- Publication number 20100219070
- Publication date Sep 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100000871
- Publication date Jan 7, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Alloy Sputtering Target and Semiconductor Element Wiring
- Publication number 20090139863
- Publication date Jun 4, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper Alloy Sputtering Target and Semiconductor Element Wiring
- Publication number 20090140430
- Publication date Jun 4, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium Alloy Target and Process for Producing the Same
- Publication number 20090057142
- Publication date Mar 5, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium Alloy Target and Process for Producing the Same
- Publication number 20090050475
- Publication date Feb 26, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium Alloy Target and Process for Producing the Same
- Publication number 20090000704
- Publication date Jan 1, 2009
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Electrolytic Copper Plating Method, Phosphorous Copper Anode for El...
- Publication number 20080210568
- Publication date Sep 4, 2008
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Packaging device and packaging method for hollow cathode type sputt...
- Publication number 20070131545
- Publication date Jun 14, 2007
- Nikko Materials Co., Ltd.
- Takeo Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper or copper alloy target/copper alloy backing plate assembly
- Publication number 20070051624
- Publication date Mar 8, 2007
- Nikko Materials Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hafnium alloy target and process for producing the same
- Publication number 20060189164
- Publication date Aug 24, 2006
- Nikko Materials Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper alloy sputtering target process for producing the same and s...
- Publication number 20060088436
- Publication date Apr 27, 2006
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper alloy sputtering target and semiconductor element wiring
- Publication number 20050285273
- Publication date Dec 29, 2005
- Nikko Materials Co., Ltd.
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper alloy sputtering target and method for manufacturing the target
- Publication number 20050121320
- Publication date Jun 9, 2005
- Takeo Okabe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Takeo Okabe

Person

Patents Grantslast 30 patents

Method of manufacturing steering shaft

Copper alloy sputtering target and semiconductor element wiring

Tungsten sintered compact sputtering target and tungsten film forme...

Copper alloy sputtering target and method for manufacturing the target

Tungsten sintered compact sputtering target and method for producin...

High-purity copper sputtering target

Copper alloy sputtering target, process for producing the same and...

Sputtering target and manufacturing method therefor

Titanium target for sputtering

Copper or copper alloy target/copper alloy backing plate assembly

High purity copper—manganese alloy sputtering target

High-purity copper-manganese-alloy sputtering target

Hafnium alloy target

Electrolytic copper plating method, phosphorous copper anode for el...

Copper alloy sputtering target and semiconductor element wiring

Hafnium alloy target

Hafnium alloy target and process for producing the same

Electrolytic copper plating method, pure copper anode for electroly...

Electrolytic copper plating method, pure copper anode for electroly...

Packaging device and packaging method for hollow cathode type sputt...

Copper alloy sputtering target process for producing the same and s...

Copper electroplating method, pure copper anode for copper electrop...

Copper alloy sputtering target and semiconductor element wiring

Hafnium alloy target and process for producing the same

Electrolytic copper plating method, phosphorus-containing anode for...

Electrolytic copper plating method, phosphorous copper anode for el...

Sputtering target producing few particles

Sputtering target producing few particles, backing plate or sputter...

Tantalum or tungsten target-copper alloy backing plate assembly and...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING STEERING SHAFT

Sputtering Target and Method for Producing Same

Sputtering Target and Method for Producing Same

Tungsten Silicide Target Member And Method For Manufacturing Same,...

Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...

Copper Alloy Sputtering Target and Semiconductor Element Wiring

TUNGSTEN SINTERED COMPACT SPUTTERING TARGET AND METHOD FOR PRODUCIN...

Sputtering Target

Tungsten Sintered Compact Sputtering Target and Tungsten Film Forme...

High-Purity Copper Sputtering Target

SPUTTERING TARGET AND MANUFACTURING METHOD THEREFOR

High Purity Copper-Manganese Alloy Sputtering Target

HIGH-PURITY COPPER-MANGANESE-ALLOY SPUTTERING TARGET

High-Purity Copper-Manganese-Alloy Sputtering Target

Titanium Target for Sputtering

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

Copper Alloy Sputtering Target, Process for Producing the Same and...

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

Copper Alloy Sputtering Target and Semiconductor Element Wiring

Copper Alloy Sputtering Target and Semiconductor Element Wiring

Hafnium Alloy Target and Process for Producing the Same

Hafnium Alloy Target and Process for Producing the Same

Hafnium Alloy Target and Process for Producing the Same

Electrolytic Copper Plating Method, Phosphorous Copper Anode for El...

Packaging device and packaging method for hollow cathode type sputt...

Copper or copper alloy target/copper alloy backing plate assembly

Hafnium alloy target and process for producing the same

Copper alloy sputtering target process for producing the same and s...

Copper alloy sputtering target and semiconductor element wiring

Copper alloy sputtering target and method for manufacturing the target