Takeo Uno

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil, and copper-clad laminate and circuit b...
- Patent number 11,680,332
- Issue date Jun 20, 2023
- Furukawa Electric Co., Ltd.
- Takahiro Tsuruta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate and printed w...
- Patent number 10,701,811
- Issue date Jun 30, 2020
- Furukawa Electric Co., Ltd.
- Takeo Uno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal material for electrical electronic component
- Patent number 9,263,814
- Issue date Feb 16, 2016
- Furukawa Electric Co., Ltd.
- Kazuo Yoshida
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface-treated copper foil, method for producing same, and copper...
- Patent number 8,852,754
- Issue date Oct 7, 2014
- Furukawa Electric Co., Ltd.
- Satoshi Fujisawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Ultra-thin copper foil with carrier and copper-clad laminate board...
- Patent number 8,674,229
- Issue date Mar 18, 2014
- Furukawa Electric Co., Ltd.
- Takeo Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Flexible copper clad laminate
- Patent number 8,557,392
- Issue date Oct 15, 2013
- Furukawa Electric Co., Ltd.
- Satoshi Fujisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil and copper clad laminate
- Patent number 8,512,873
- Issue date Aug 20, 2013
- Furukawa Electric Co., Ltd.
- Satoshi Fujisawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Connector and metallic material for connector
- Patent number 8,342,895
- Issue date Jan 1, 2013
- Furukawa Electric Co., Ltd.
- Kazuo Yoshida
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper alloy for electronic machinery and tools and method of produ...
- Patent number 7,946,022
- Issue date May 24, 2011
- The Furukawa Electric Co., Ltd.
- Takeo Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT B...
- Publication number 20210212204
- Publication date Jul 8, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro TSURUTA
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED W...
- Publication number 20200029444
- Publication date Jan 23, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Takeo UNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER...
- Publication number 20130040162
- Publication date Feb 14, 2013
- FURUKAWA ELECTRIC CO. LTD.
- Satoshi Fujisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMIN...
- Publication number 20120285734
- Publication date Nov 15, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Takeo Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER AND COPPER-CLAD LAMINATE BOARD...
- Publication number 20110209903
- Publication date Sep 1, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Takeo Uno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20110189501
- Publication date Aug 4, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Satoshi Fujisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20110189499
- Publication date Aug 4, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Satoshi Fujisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL MATERIAL FOR ELECTRICAL ELECTRONIC COMPONENT
- Publication number 20100304177
- Publication date Dec 2, 2010
- Kazuo Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-COATED COMPOSITE MATERIAL FOR MOVABLE CONTACT AND METHOD FOR...
- Publication number 20100233506
- Publication date Sep 16, 2010
- FURUKAWA ELECTRIC CO., LTD.
- Naofumi Tokuhara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY STRIP MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENTS
- Publication number 20100221576
- Publication date Sep 2, 2010
- Kuniteru Mihara
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONNECTOR AND METALLIC MATERIAL FOR CONNECTOR
- Publication number 20100190390
- Publication date Jul 29, 2010
- Kazuo Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper alloy for electronic machinery and tools and method of produ...
- Publication number 20070015001
- Publication date Jan 18, 2007
- THE FURUKAWA ELECTRIC CO., LTD.
- Takeo Uno
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Surface-treated copper foil, and copper-clad laminate and circuit b...

Surface-treated copper foil, and copper-clad laminate and printed w...

Metal material for electrical electronic component

Surface-treated copper foil, method for producing same, and copper...

Ultra-thin copper foil with carrier and copper-clad laminate board...

Flexible copper clad laminate

Surface treated copper foil and copper clad laminate

Connector and metallic material for connector

Copper alloy for electronic machinery and tools and method of produ...

Patents Applicationslast 30 patents

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT B...

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED W...

SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER...

ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMIN...

ULTRA-THIN COPPER FOIL WITH CARRIER AND COPPER-CLAD LAMINATE BOARD...

FLEXIBLE COPPER CLAD LAMINATE

SURFACE TREATED COPPER FOIL AND COPPER CLAD LAMINATE

METAL MATERIAL FOR ELECTRICAL ELECTRONIC COMPONENT

SILVER-COATED COMPOSITE MATERIAL FOR MOVABLE CONTACT AND METHOD FOR...

COPPER ALLOY STRIP MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENTS

CONNECTOR AND METALLIC MATERIAL FOR CONNECTOR

Copper alloy for electronic machinery and tools and method of produ...