Takeru Takushima

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of polishing a silicon wafer
- Patent number 8,877,643
- Issue date Nov 4, 2014
- Sumco Corporation
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing silicon wafer
- Patent number 8,147,295
- Issue date Apr 3, 2012
- Sumco Corporation
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POLISHING SILICON WAFER
- Publication number 20130095660
- Publication date Apr 18, 2013
- SUMCO CORPORATION
- Ryuichi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POLISHING SILICON WAFER AS WELL AS SILICON WAFER
- Publication number 20120080775
- Publication date Apr 5, 2012
- Shuhei Matsuda
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF POLISHING SILICON WAFER
- Publication number 20090298394
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS