Takeshi Fujiwara

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Moriyama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package, chip size package device and method of manufac...
- Patent number 8,975,736
- Issue date Mar 10, 2015
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flow sensor, method of manufacturing the same and fuel cell system
- Patent number 6,684,694
- Issue date Feb 3, 2004
- Omron Corporation
- Takeshi Fujiwara
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20140202838
- Publication date Jul 24, 2014
- Omron Corporation
- Akihiko Sano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY
- Publication number 20140034465
- Publication date Feb 6, 2014
- Omron Corporation
- Takahiro Masuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE, CHIP SIZE PACKAGE DEVICE AND METHOD OF MANUFAC...
- Publication number 20140008779
- Publication date Jan 9, 2014
- Omron Corporation
- Toshiaki Okuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SWITCH AND METHOD FOR MANUFACTURING THE SAME, AND RELAY
- Publication number 20110209970
- Publication date Sep 1, 2011
- Omron Corporation
- Takahiro Masuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY