Takeshi Kagamida

Person

Mitaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer slice base peeling system
- Patent number 5,853,533
- Issue date Dec 29, 1998
- Tokyo Seimitsu Co., Ltd.
- Masaaki Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer slice base peeling system
- Patent number 5,849,147
- Issue date Dec 15, 1998
- Tokyo Seimitsu Co., Ltd.
- Masaaki Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer slicer base peeling system
- Patent number 5,759,344
- Issue date Jun 2, 1998
- Tokyo Seimitsu Co., Ltd.
- Masaaki Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding apparatus for wafer edge
- Patent number 5,658,189
- Issue date Aug 19, 1997
- Tokyo Seimitsu Co., Ltd.
- Takeshi Kagamida
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer chamfering machine
- Patent number 5,609,514
- Issue date Mar 11, 1997
- Tokyo Seimitsu Co., Ltd.
- Masaaki Yasunaga
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for manufacturing wafer
- Patent number 5,582,536
- Issue date Dec 10, 1996
- Tokyo Seimitsu Co., Ltd.
- Takeshi Kagamida
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer diameter/sectional shape measuring machine
- Patent number 5,555,091
- Issue date Sep 10, 1996
- Tokyo Seimitsu Co., Ltd.
- Takeshi Kagamida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafer and system therefor
- Patent number 5,427,644
- Issue date Jun 27, 1995
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE

Takeshi Kagamida

Person

Patents Grantslast 30 patents

Wafer slice base peeling system

Wafer slice base peeling system

Wafer slicer base peeling system

Grinding apparatus for wafer edge

Wafer chamfering machine

Apparatus and method for manufacturing wafer

Wafer diameter/sectional shape measuring machine

Method of manufacturing semiconductor wafer and system therefor