Takeshi Kusakabe

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Kanagawa-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and a packaging assembly using the same
- Patent number 6,995,320
- Issue date Feb 7, 2006
- Kabushiki Kaisha Toshiba
- Takeshi Kusakabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring pattern of semiconductor device
- Patent number 6,713,869
- Issue date Mar 30, 2004
- Kabushiki Kaisha Toshiba
- Takeshi Kusakabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wiring board and a packaging assembly using the same
- Publication number 20040104465
- Publication date Jun 3, 2004
- Kabushiki Kaisha Toshiba
- Takeshi Kusakabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring pattern of semiconductor device
- Publication number 20030071364
- Publication date Apr 17, 2003
- Takeshi Kusakabe
- H01 - BASIC ELECTRIC ELEMENTS