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Takeshi Matsumura
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Ibaraki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Sheet for sealing and method for manufacturing semiconductor device...
Patent number
9,754,894
Issue date
Sep 5, 2017
Nitto Denko Corporation
Chie Iino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dicing tape-integrated film for semiconductor back surface
Patent number
9,362,156
Issue date
Jun 7, 2016
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Manufacturing semiconductor device with film for forming protective...
Patent number
9,279,064
Issue date
Mar 8, 2016
Nitto Denko Corporation
Takashi Oda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
Patent number
9,153,556
Issue date
Oct 6, 2015
Nitto Denko Corporation
Takeshi Matsumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin sheet for sealing electronic component, resin-s...
Patent number
9,147,625
Issue date
Sep 29, 2015
Nitto Denko Corporation
Yusaku Shimizu
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dicing die bond film and method of manufacturing semiconductor device
Patent number
9,142,457
Issue date
Sep 22, 2015
Nitto Denko Corporation
Shumpei Tanaka
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dicing tape-integrated film for semiconductor back surface
Patent number
9,035,466
Issue date
May 19, 2015
Nitto Denko Corporation
Naohide Takamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
Patent number
8,975,759
Issue date
Mar 10, 2015
Nitto Denko Corporation
Sadahito Misumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film for the backside of flip-chip type semiconductor, dicing tape-...
Patent number
8,841,757
Issue date
Sep 23, 2014
Nitto Denko Corporation
Daisuke Uenda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dicing tape-integrated wafer back surface protective film
Patent number
8,841,780
Issue date
Sep 23, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dicing tape-integrated wafer back surface protective film
Patent number
8,810,044
Issue date
Aug 19, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Manufacturing method of laser processed parts, and pressure-sensiti...
Patent number
8,778,118
Issue date
Jul 15, 2014
Nitto Denko Corporation
Masakatsu Urairi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dicing tape-integrated wafer back surface protective film
Patent number
8,766,462
Issue date
Jul 1, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Film for flip chip type semiconductor back surface
Patent number
8,704,382
Issue date
Apr 22, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dicing tape-integrated film for semiconductor back surface
Patent number
8,698,324
Issue date
Apr 15, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dicing tape-integrated film for semiconductor back surface
Patent number
8,692,389
Issue date
Apr 8, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Adhesive composition for producing semiconductor device and adhesiv...
Patent number
8,659,157
Issue date
Feb 25, 2014
Nitto Denko Corporation
Yuta Kimura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dicing tape-integrated wafer back surface protective film
Patent number
8,648,476
Issue date
Feb 11, 2014
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Adhesive sheet for producing semiconductor device
Patent number
8,638,001
Issue date
Jan 28, 2014
Nitto Denko Corporation
Yuta Kimura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dicing/die bonding film
Patent number
8,617,928
Issue date
Dec 31, 2013
Nitto Denko Corporation
Katsuhiko Kamiya
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dicing film with protecting film
Patent number
8,614,139
Issue date
Dec 24, 2013
Nitto Denko Corporation
Yuichiro Shishido
B32 - LAYERED PRODUCTS
Information
Patent Grant
Process for producing a semiconductor device
Patent number
8,592,260
Issue date
Nov 26, 2013
Nitto Denko Corporation
Masami Oikawa
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dicing/die-bonding film, method of fixing chipped work and semicond...
Patent number
8,586,415
Issue date
Nov 19, 2013
Nitto Denko Corporation
Takeshi Matsumura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Thermosetting die-bonding film
Patent number
8,580,617
Issue date
Nov 12, 2013
Nitto Denko Corporation
Yuki Sugo
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dicing tape-integrated wafer back surface protective film
Patent number
8,558,397
Issue date
Oct 15, 2013
Nitto Denko Corporation
Naohide Takamoto
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method of manufacturing semiconductor device having a bumped wafer...
Patent number
8,518,745
Issue date
Aug 27, 2013
Nitto Denko Corporation
Takashi Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film for flip chip type semiconductor back surface
Patent number
8,420,509
Issue date
Apr 16, 2013
Nitto Denko Corporation
Naohide Takamoto
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Dicing die-bonding film
Patent number
8,304,341
Issue date
Nov 6, 2012
Nitto Denko Corporation
Takeshi Matsumura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Manufacturing method of semiconductor device, adhesive sheet used t...
Patent number
8,278,153
Issue date
Oct 2, 2012
Nitto Denko Corporation
Sadahito Misumi
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Tape for holding chip, method of holding chip-shaped workpiece, met...
Patent number
8,278,151
Issue date
Oct 2, 2012
Nitto Denko Corporation
Shuhei Murata
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING FUEL-CELL MEMBRANE ELECTRODE ASSEMBLY
Publication number
20160285120
Publication date
Sep 29, 2016
NITTO DENKO CORPORATION
Takeshi NAKANO
B32 - LAYERED PRODUCTS
Information
Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR CONVEYING ELECTROLYTE MEMBRAN...
Publication number
20160254559
Publication date
Sep 1, 2016
NITTO DENKO CORPORATION
Takeshi NAKANO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
Publication number
20160211217
Publication date
Jul 21, 2016
NITTO DENKO CORPORATION
Chie IINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY-DETACHABLE SHEET
Publication number
20140249269
Publication date
Sep 4, 2014
Daisuke Uenda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
Publication number
20140175677
Publication date
Jun 26, 2014
Nitto Denko Corporation
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
Publication number
20140159254
Publication date
Jun 12, 2014
Nitto Denko Corporation
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING FILM WITH PROTECTING FILM
Publication number
20140106106
Publication date
Apr 17, 2014
Nitto Denko Corporation
Yuichiro Shishido
B32 - LAYERED PRODUCTS
Information
Patent Application
DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM
Publication number
20140091480
Publication date
Apr 3, 2014
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM
Publication number
20140084490
Publication date
Mar 27, 2014
Nitto Denko Corporation
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-S...
Publication number
20140061955
Publication date
Mar 6, 2014
Nitto Denko Corporation
Yusaku Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEM...
Publication number
20140042645
Publication date
Feb 13, 2014
Nitto Denko Corporation
Yusaku Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN LED
Publication number
20140004635
Publication date
Jan 2, 2014
Tomokazu TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN LED
Publication number
20140000793
Publication date
Jan 2, 2014
Tomokazu TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
Publication number
20140004683
Publication date
Jan 2, 2014
Shinya Akizuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN LED
Publication number
20140004636
Publication date
Jan 2, 2014
Tomokazu TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN LED
Publication number
20140004637
Publication date
Jan 2, 2014
Tomokazu TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING DIE BOND FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20130330910
Publication date
Dec 12, 2013
Shumpei Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM
Publication number
20130285262
Publication date
Oct 31, 2013
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Releas...
Publication number
20130273361
Publication date
Oct 17, 2013
Katsuhiko KAMIYA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
FILM FOR FORMING PROTECTIVE LAYER
Publication number
20130217187
Publication date
Aug 22, 2013
Nitto Denko Corporation
Takashi Oda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METH...
Publication number
20130185934
Publication date
Jul 25, 2013
Nitto Denko Corporation
Eiji TOYODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN SHEET FOR HOLLOW ENCAPSULATION AND PRODUCTION METHOD FOR THE...
Publication number
20130183469
Publication date
Jul 18, 2013
Nitto Denko Corporation
Yusaku SHIMIZU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20130157419
Publication date
Jun 20, 2013
Nitto Denko Corporation
Yusaku Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE ADHESIVE SHEET, METHOD FOR PRODUCING THE SAME, COLLECTOR...
Publication number
20130139874
Publication date
Jun 6, 2013
Nitto Denko Corporation
Hiroshi YAMAZAKI
B32 - LAYERED PRODUCTS
Information
Patent Application
DICING DIE-BONDING FILM
Publication number
20130034935
Publication date
Feb 7, 2013
Takeshi MATSUMURA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED T...
Publication number
20130020724
Publication date
Jan 24, 2013
Sadahito Misumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE AND ADHESIV...
Publication number
20120302042
Publication date
Nov 29, 2012
Yuta KIMURA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE
Publication number
20120295416
Publication date
Nov 22, 2012
Yuta KIMURA
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
CLEANING SHEET, CLEANING MEMBER, CLEANING METHOD, AND CONTINUITY TE...
Publication number
20120280706
Publication date
Nov 8, 2012
Nitto Denko Corporation
Daisuke Uenda
B08 - CLEANING
Information
Patent Application
DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM
Publication number
20120261839
Publication date
Oct 18, 2012
Nitto Denko Corporation
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS