Takeshi Morikawa

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Patent number 6,835,600
- Issue date Dec 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masaki Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Patent number 6,603,194
- Issue date Aug 5, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masaki Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing resin-molded semiconductor device
- Patent number 6,258,314
- Issue date Jul 10, 2001
- Matsushita Electronics Corporation
- Seishi Oida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Plastic encapsulated semiconductor device and method of manufacturi...
- Patent number 6,130,115
- Issue date Oct 10, 2000
- Matsushita Electronics Corporation
- Ichiro Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing resin-molded semiconductor device
- Patent number 6,126,885
- Issue date Oct 3, 2000
- Matsushita Electronics Corporation
- Seishi Oida
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Plastic encapsulated semiconductor device and method of manufacturi...
- Patent number 5,942,794
- Issue date Aug 24, 1999
- Matsushita Electronics Corporation
- Ichiro Okumura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Publication number 20030203541
- Publication date Oct 30, 2003
- Matsushita Electric Industrial Co., Ltd.
- Masaki Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and method for fabricating resin-encapsulated semiconduc...
- Publication number 20020109973
- Publication date Aug 15, 2002
- Masaki Utsumi
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi Morikawa

Person

Patents Grantslast 30 patents

Lead frame and method for fabricating resin-encapsulated semiconduc...

Lead frame and method for fabricating resin-encapsulated semiconduc...

Method for manufacturing resin-molded semiconductor device

Plastic encapsulated semiconductor device and method of manufacturi...

Method for manufacturing resin-molded semiconductor device

Plastic encapsulated semiconductor device and method of manufacturi...

Patents Applicationslast 30 patents

Lead frame and method for fabricating resin-encapsulated semiconduc...

Lead frame and method for fabricating resin-encapsulated semiconduc...