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Takeshi Muraki
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Hyogo, JP
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Patents Grants
last 30 patents
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Patent Grant
Wiring board, fabrication method of wiring board, and semiconductor...
Patent number
7,038,143
Issue date
May 2, 2006
Mitsubishi Denki Kabushiki Kaisha
Shigeru Utsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing multi-layer printed wiring board
Patent number
6,664,127
Issue date
Dec 16, 2003
Mitsubishi Denki Kabushiki Kaisha
Seiji Oka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing multi-layer printed wiring board
Patent number
6,451,710
Issue date
Sep 17, 2002
Mitsubishi Denki Kabushiki Kaisha
Seiji Oka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit device
Patent number
5,892,288
Issue date
Apr 6, 1999
Mitsubishi Denki Kabushiki Kaisha
Takeshi Muraki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Wiring board, fabrication method of wiring board, and semiconductor...
Publication number
20030213615
Publication date
Nov 20, 2003
Mitsubishi Denki Kabushiki Kaisha
Shigeru Utsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing multi-layer printed wiring board
Publication number
20020023343
Publication date
Feb 28, 2002
Seiji Oka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing multi-layer printed wiring board
Publication number
20020016018
Publication date
Feb 7, 2002
Seiji Oka
H01 - BASIC ELECTRIC ELEMENTS