Takeshi NEGISHI

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Communication management system, relay device, communication contro...
- Patent number 9,503,893
- Issue date Nov 22, 2016
- Ricoh Company, Ltd.
- Takeshi Negishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Insulation substrate, power module substrate, manufacturing method...
- Patent number 8,188,376
- Issue date May 29, 2012
- Mitsubishi Materials Corporation
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Al/AlN joint material, base plate for power module, power module, a...
- Patent number 8,164,909
- Issue date Apr 24, 2012
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation substrate, power module substrate, manufacturing method...
- Patent number 8,001,682
- Issue date Aug 23, 2011
- Mitsubishi Materials Corporation
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Al/AlN joint material, base plate for power module, power module, a...
- Patent number 7,532,481
- Issue date May 12, 2009
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooled heat sink and manufacturing method thereof
- Patent number 6,563,709
- Issue date May 13, 2003
- Mitsubishi Materials Corporation
- Takeshi Negishi
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMMUNICATION MANAGEMENT SYSTEM, RELAY DEVICE, COMMUNICATION CONTRO...
- Publication number 20140204833
- Publication date Jul 24, 2014
- Takeshi NEGISHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...
- Publication number 20100230473
- Publication date Sep 16, 2010
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION SUBSTRATE, POWER MODULE SUBSTRATE, MANUFACTURING METHOD...
- Publication number 20100053903
- Publication date Mar 4, 2010
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...
- Publication number 20080248326
- Publication date Oct 9, 2008
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation Substrate, Power Module Substrate, Manufacturing Method...
- Publication number 20070297162
- Publication date Dec 27, 2007
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Negishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ai/Ain Joint Material, Base Plate For Power Module, Power Module, A...
- Publication number 20070274047
- Publication date Nov 29, 2007
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-conducting multilayer substrate and power module substrate
- Publication number 20040188828
- Publication date Sep 30, 2004
- MITSUBISHI MATERIALS CORPORATION
- Yoshiyuki Nagatomo
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Liquid-cooled heat sink and manufacturing method thereof
- Publication number 20020101718
- Publication date Aug 1, 2002
- Takeshi Negishi
- F28 - HEAT EXCHANGE IN GENERAL

Takeshi NEGISHI

Person

Patents Grantslast 30 patents

Communication management system, relay device, communication contro...

Insulation substrate, power module substrate, manufacturing method...

Al/AlN joint material, base plate for power module, power module, a...

Insulation substrate, power module substrate, manufacturing method...

Al/AlN joint material, base plate for power module, power module, a...

Liquid-cooled heat sink and manufacturing method thereof

Patents Applicationslast 30 patents

COMMUNICATION MANAGEMENT SYSTEM, RELAY DEVICE, COMMUNICATION CONTRO...

Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...

INSULATION SUBSTRATE, POWER MODULE SUBSTRATE, MANUFACTURING METHOD...

AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, A...

Insulation Substrate, Power Module Substrate, Manufacturing Method...

Ai/Ain Joint Material, Base Plate For Power Module, Power Module, A...

Heat-conducting multilayer substrate and power module substrate

Liquid-cooled heat sink and manufacturing method thereof