Takeshi OKAMOTO

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240421049
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Takeshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230420324
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Takayuki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS