TAKESHI SADOHARA

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AYASE-SHI, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer flattening system
- Patent number 6,360,687
- Issue date Mar 26, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer flattening process
- Patent number 6,303,511
- Issue date Oct 16, 2001
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCAL ETCHING APPARATUS AND LOCAL ETCHING METHOD
- Publication number 20010032705
- Publication date Oct 25, 2001
- TAKESHI SADOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FLATTENING PROCESS
- Publication number 20010002336
- Publication date May 31, 2001
- MICHIHIKO YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS