Takeshi SAKAMOTO

Person

Hamamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser processing method, semiconductor device manufacturing method,...
- Patent number 12,327,766
- Issue date Jun 10, 2025
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 12,275,091
- Issue date Apr 15, 2025
- Hamamatsu Photonics K.K.
- Katsuhiro Korematsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection device and processing system
- Patent number 12,272,577
- Issue date Apr 8, 2025
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing device for forming a modified region in an object...
- Patent number 12,246,397
- Issue date Mar 11, 2025
- Hamamatsu Photonics K.K.
- Takafumi Ogiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device
- Patent number 12,157,187
- Issue date Dec 3, 2024
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining head and laser machining device
- Patent number 12,145,214
- Issue date Nov 19, 2024
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece cutting method
- Patent number 12,042,882
- Issue date Jul 23, 2024
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection device and inspection method
- Patent number 12,023,761
- Issue date Jul 2, 2024
- Hamamatsu Photonics K.K.
- Iku Sano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing device and laser processing method
- Patent number 11,897,056
- Issue date Feb 13, 2024
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing machine
- Patent number D1013746
- Issue date Feb 6, 2024
- Hamamatsu Photonics K.K.
- Junji Okuma
- D15 - Machines not elsewhere specified
Information Patent Grant
Laser machining device
- Patent number 11,833,611
- Issue date Dec 5, 2023
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated element manufacturing method
- Patent number 11,817,319
- Issue date Nov 14, 2023
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece cutting method
- Patent number 11,806,805
- Issue date Nov 7, 2023
- Kyoritsu Chemical & Co., Ltd.
- Mikiharu Kuchiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device
- Patent number 11,794,278
- Issue date Oct 24, 2023
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting method of workpiece by forming reformed region and dry etch...
- Patent number 11,482,455
- Issue date Oct 25, 2022
- Iwatani Corporation
- Toshiki Manabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method, method for manufacturing semiconductor dev...
- Patent number 11,450,576
- Issue date Sep 20, 2022
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece cutting method
- Patent number 11,413,708
- Issue date Aug 16, 2022
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cover member and wire harness
- Patent number 11,377,047
- Issue date Jul 5, 2022
- Yazaki Corporation
- Yoshiro Tasaka
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Cutting method
- Patent number 11,380,586
- Issue date Jul 5, 2022
- Iwatani Corporation
- Toshiki Manabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming openings at intersection of cutting lines
- Patent number 11,367,655
- Issue date Jun 21, 2022
- Hamamatsu Photonics K.K.
- Tomoya Taguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece cutting method and semiconductor chip
- Patent number 11,270,915
- Issue date Mar 8, 2022
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated element manufacturing method
- Patent number 11,211,250
- Issue date Dec 28, 2021
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated element manufacturing method
- Patent number 11,158,601
- Issue date Oct 26, 2021
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated element manufacturing method
- Patent number 11,069,672
- Issue date Jul 20, 2021
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing machine for producing semiconductors
- Patent number D921068
- Issue date Jun 1, 2021
- Hamamatsu Photonics K.K.
- Junji Okuma
- D15 - Machines not elsewhere specified
Information Patent Grant
Laser processing machine
- Patent number D920397
- Issue date May 25, 2021
- Hamamatsu Photonics K.K.
- Junji Okuma
- D15 - Machines not elsewhere specified
Information Patent Grant
Laser processing machine
- Patent number D920398
- Issue date May 25, 2021
- Hamamatsu Photonics K.K.
- Junji Okuma
- D15 - Machines not elsewhere specified
Information Patent Grant
Laser processing device and laser processing method
- Patent number 11,007,607
- Issue date May 18, 2021
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing machine
- Patent number D918276
- Issue date May 4, 2021
- Hamamatsu Photonics K.K.
- Junji Okuma
- D15 - Machines not elsewhere specified
Information Patent Grant
Wafer processing machine for producing semiconductors
- Patent number D917585
- Issue date Apr 27, 2021
- Hamamatsu Photonics K.K.
- Junji Okuma
- D15 - Machines not elsewhere specified

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
- Publication number 20250105011
- Publication date Mar 27, 2025
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MACHINING CONDITION ACQUISITION METHOD AND LASER MACHINING DEVICE
- Publication number 20250100085
- Publication date Mar 27, 2025
- Hamamatsu Photonics K.K.
- Yo SUGIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE
- Publication number 20250091164
- Publication date Mar 20, 2025
- HAMAMATSU PHOTONICS K. K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20250050454
- Publication date Feb 13, 2025
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20250025963
- Publication date Jan 23, 2025
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20240286226
- Publication date Aug 29, 2024
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING APPARATUS AND LASER MACHINING METHOD
- Publication number 20240238897
- Publication date Jul 18, 2024
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20240238905
- Publication date Jul 18, 2024
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING METHOD AND LASER MACHINING DEVICE
- Publication number 20240181560
- Publication date Jun 6, 2024
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20240082959
- Publication date Mar 14, 2024
- Hamamatsu Photonics K.K.
- Yo SUGIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20240051067
- Publication date Feb 15, 2024
- Hamamatsu Photonics K.K.
- Yo SUGIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING METHOD
- Publication number 20240033859
- Publication date Feb 1, 2024
- Hamamatsu Photonics K.K.
- Yo SUGIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE CUTTING METHOD AND RESIN APPLYING DEVICE
- Publication number 20230343646
- Publication date Oct 26, 2023
- KYORITSU CHEMICAL & CO., LTD.
- Daisuke KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION DEVICE AND PROCESSING SYSTEM
- Publication number 20230335421
- Publication date Oct 19, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMBER MANUFACTURING METHOD
- Publication number 20230307237
- Publication date Sep 28, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230294212
- Publication date Sep 21, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR M...
- Publication number 20230249285
- Publication date Aug 10, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230245906
- Publication date Aug 3, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER MACHINING APPARATUS, LASER MACHINING METHOD, AND METHOD FOR M...
- Publication number 20230219172
- Publication date Jul 13, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230158609
- Publication date May 25, 2023
- Hamamatsu Photonics K.K.
- Iku SANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION DEVICE AND INSPECTION METHOD
- Publication number 20230154774
- Publication date May 18, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230120386
- Publication date Apr 20, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION DEVICE AND INSPECTION METHOD
- Publication number 20230113051
- Publication date Apr 13, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION DEVICE AND INSPECTION METHOD
- Publication number 20230109456
- Publication date Apr 6, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Publication number 20230095941
- Publication date Mar 30, 2023
- Hamamatsu Photonics K.K.
- Iku SANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230086426
- Publication date Mar 23, 2023
- Hamamatsu Photonics K.K.
- Katsuhiro KOREMATSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230057674
- Publication date Feb 23, 2023
- Hamamatsu Photonics K.K.
- Katsuhiro KOREMATSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
- Publication number 20230054570
- Publication date Feb 23, 2023
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE
- Publication number 20220410311
- Publication date Dec 29, 2022
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD
- Publication number 20220355413
- Publication date Nov 10, 2022
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Takeshi SAKAMOTO

Person

Patents Grantslast 30 patents

Laser processing method, semiconductor device manufacturing method,...

Laser processing apparatus and laser processing method

Inspection device and processing system

Laser processing device for forming a modified region in an object...

Laser machining device

Laser machining head and laser machining device

Workpiece cutting method

Inspection device and inspection method

Laser processing device and laser processing method

Laser processing machine

Laser machining device

Laminated element manufacturing method

Workpiece cutting method

Laser machining device

Cutting method of workpiece by forming reformed region and dry etch...

Laser processing method, method for manufacturing semiconductor dev...

Workpiece cutting method

Cover member and wire harness

Cutting method

Forming openings at intersection of cutting lines

Workpiece cutting method and semiconductor chip

Laminated element manufacturing method

Laminated element manufacturing method

Laminated element manufacturing method

Wafer processing machine for producing semiconductors

Laser processing machine

Laser processing machine

Laser processing device and laser processing method

Laser processing machine

Wafer processing machine for producing semiconductors

Patents Applicationslast 30 patents

LASER PROCESSING METHOD AND LASER PROCESSING DEVICE

MACHINING CONDITION ACQUISITION METHOD AND LASER MACHINING DEVICE

LASER MACHINING DEVICE

LASER PROCESSING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER MACHINING APPARATUS AND LASER MACHINING METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER MACHINING METHOD AND LASER MACHINING DEVICE

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER MACHINING METHOD

WORKPIECE CUTTING METHOD AND RESIN APPLYING DEVICE

INSPECTION DEVICE AND PROCESSING SYSTEM

SEMICONDUCTOR MEMBER MANUFACTURING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER MACHINING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR M...

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER MACHINING APPARATUS, LASER MACHINING METHOD, AND METHOD FOR M...

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

INSPECTION DEVICE AND INSPECTION METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

INSPECTION DEVICE AND INSPECTION METHOD

INSPECTION DEVICE AND INSPECTION METHOD

LASER MACHINING DEVICE AND LASER MACHINING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

LASER PROCESSING DEVICE

LASER PROCESSING DEVICE, AND LASER PROCESSING METHOD