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Takeshi SAKAMOTO

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  • Hamamatsu-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser processing device and laser processing method
    • Patent number 11,897,056
    • Issue date Feb 13, 2024
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing machine
    • Patent number D1013746
    • Issue date Feb 6, 2024
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Laser machining device
    • Patent number 11,833,611
    • Issue date Dec 5, 2023
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laminated element manufacturing method
    • Patent number 11,817,319
    • Issue date Nov 14, 2023
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece cutting method
    • Patent number 11,806,805
    • Issue date Nov 7, 2023
    • Kyoritsu Chemical & Co., Ltd.
    • Mikiharu Kuchiki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser machining device
    • Patent number 11,794,278
    • Issue date Oct 24, 2023
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cutting method of workpiece by forming reformed region and dry etch...
    • Patent number 11,482,455
    • Issue date Oct 25, 2022
    • Iwatani Corporation
    • Toshiki Manabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method, method for manufacturing semiconductor dev...
    • Patent number 11,450,576
    • Issue date Sep 20, 2022
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece cutting method
    • Patent number 11,413,708
    • Issue date Aug 16, 2022
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cover member and wire harness
    • Patent number 11,377,047
    • Issue date Jul 5, 2022
    • Yazaki Corporation
    • Yoshiro Tasaka
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Cutting method
    • Patent number 11,380,586
    • Issue date Jul 5, 2022
    • Iwatani Corporation
    • Toshiki Manabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Forming openings at intersection of cutting lines
    • Patent number 11,367,655
    • Issue date Jun 21, 2022
    • Hamamatsu Photonics K.K.
    • Tomoya Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Workpiece cutting method and semiconductor chip
    • Patent number 11,270,915
    • Issue date Mar 8, 2022
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laminated element manufacturing method
    • Patent number 11,211,250
    • Issue date Dec 28, 2021
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laminated element manufacturing method
    • Patent number 11,158,601
    • Issue date Oct 26, 2021
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Laminated element manufacturing method
    • Patent number 11,069,672
    • Issue date Jul 20, 2021
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing machine for producing semiconductors
    • Patent number D921068
    • Issue date Jun 1, 2021
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Laser processing machine
    • Patent number D920397
    • Issue date May 25, 2021
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Laser processing machine
    • Patent number D920398
    • Issue date May 25, 2021
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Laser processing device and laser processing method
    • Patent number 11,007,607
    • Issue date May 18, 2021
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing machine
    • Patent number D918276
    • Issue date May 4, 2021
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Wafer processing machine for producing semiconductors
    • Patent number D917585
    • Issue date Apr 27, 2021
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Laser processing machine
    • Patent number D917586
    • Issue date Apr 27, 2021
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • D15 - Machines not elsewhere specified
  • Information Patent Grant

    Semiconductor wafer
    • Patent number D897974
    • Issue date Oct 6, 2020
    • Hamamatsu Photonics K.K.
    • Tomoya Taguchi
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Light-receiving device
    • Patent number D884659
    • Issue date May 19, 2020
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Light-receiving device
    • Patent number D884660
    • Issue date May 19, 2020
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Laser processing method
    • Patent number 10,532,431
    • Issue date Jan 14, 2020
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser machining device and laser machining method
    • Patent number 10,525,553
    • Issue date Jan 7, 2020
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser machining device and laser machining method
    • Patent number 10,328,521
    • Issue date Jun 25, 2019
    • Hamamatsu Photonics K.K.
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing method
    • Patent number 9,295,969
    • Issue date Mar 29, 2016
    • Hamamatsu Photonics K.K.
    • Junji Okuma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents