Takeshi Segawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing chip with adhesive applied
- Patent number 8,691,666
- Issue date Apr 8, 2014
- Lintec Corporation
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transporting work and apparatus with work handover mechanism
- Patent number 8,529,314
- Issue date Sep 10, 2013
- Lintec Corporation
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing jig and method of processing work
- Patent number 8,465,011
- Issue date Jun 18, 2013
- Lintec Corporation
- Takeshi Segawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor wafer processing tape winding body, semiconductor waf...
- Patent number 8,392,011
- Issue date Mar 5, 2013
- Lintec Corporation
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Holding jig, semiconductor wafer grinding method, semiconductor waf...
- Patent number 8,212,345
- Issue date Jul 3, 2012
- Shin-Etsu Polymer Co., Ltd.
- Kiyofumi Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Fixed jig, chip pickup method and chip pickup apparatus
- Patent number 8,182,649
- Issue date May 22, 2012
- Lintec Corporation
- Kenichi Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure with a built-in recording medium, a laminate comprising t...
- Patent number 7,939,464
- Issue date May 10, 2011
- Lintec Corporation
- Tetsuyuki Utagawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Holding jig, semiconductor wafer grinding method, semiconductor waf...
- Patent number 7,875,501
- Issue date Jan 25, 2011
- Shin-Etsu Polymer Co., Ltd.
- Kiyofumi Tanaka
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...
- Publication number 20110281509
- Publication date Nov 17, 2011
- Lintec Corporation
- KIYOFUMI TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus
- Publication number 20100314894
- Publication date Dec 16, 2010
- LINTEC CORPORATION
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Pickup Method and Chip Pickup Apparatus
- Publication number 20100289283
- Publication date Nov 18, 2010
- LINTEC CORPORATION
- Kenichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSPORTING WORK AND APPARATUS WITH WORK HANDOVER MECHANISM
- Publication number 20100189533
- Publication date Jul 29, 2010
- LINTEC CORPORATION
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING JIG AND METHOD OF PROCESSING WORK
- Publication number 20100164155
- Publication date Jul 1, 2010
- LINTEC CORPORATION
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Chip with Adhesive Applied
- Publication number 20100144120
- Publication date Jun 10, 2010
- LINTEC CORPORATION
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...
- Publication number 20090081852
- Publication date Mar 26, 2009
- Shin-etsu Polymer Co., Ltd.
- Kiyofumi Tanaka
- B24 - GRINDING POLISHING
Information Patent Application
Structure with a built-in recording medium, a laminate comprising t...
- Publication number 20080119359
- Publication date May 22, 2008
- LINTEC CORPORATION
- Tetsuyuki Utagawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor wafer processing tape winding body, semiconductor waf...
- Publication number 20070162175
- Publication date Jul 12, 2007
- Lintec Corporation
- Takeshi Segawa
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi Segawa

Person

Patents Grantslast 30 patents

Method for producing chip with adhesive applied

Method of transporting work and apparatus with work handover mechanism

Fixing jig and method of processing work

Semiconductor wafer processing tape winding body, semiconductor waf...

Holding jig, semiconductor wafer grinding method, semiconductor waf...

Fixed jig, chip pickup method and chip pickup apparatus

Structure with a built-in recording medium, a laminate comprising t...

Holding jig, semiconductor wafer grinding method, semiconductor waf...

Patents Applicationslast 30 patents

HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...

Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus

Chip Pickup Method and Chip Pickup Apparatus

METHOD OF TRANSPORTING WORK AND APPARATUS WITH WORK HANDOVER MECHANISM

FIXING JIG AND METHOD OF PROCESSING WORK

Method for Producing Chip with Adhesive Applied

HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAF...

Structure with a built-in recording medium, a laminate comprising t...

Semiconductor wafer processing tape winding body, semiconductor waf...