Takeshi Shioga

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Information processing device, computer-readable recording medium r...
- Patent number 11,797,734
- Issue date Oct 24, 2023
- Fujitsu Limited
- Takeshi Shioga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Loop heat pipe
- Patent number 11,789,505
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fabrication method for loop heat pipe
- Patent number 11,536,518
- Issue date Dec 27, 2022
- Fujitsu Limited
- Takeshi Shioga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loop heat pipe and electronic device
- Patent number 11,044,830
- Issue date Jun 22, 2021
- Fujitsu Limited
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe, method of manufacturing the same, and electronic de...
- Patent number 11,009,927
- Issue date May 18, 2021
- Shinko Electric Industries Co., Ltd.
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe and fabrication method therefor, and electronic device
- Patent number 10,881,021
- Issue date Dec 29, 2020
- Fujitsu Limited
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe and manufacturing method for loop heat pipe and elec...
- Patent number 10,624,238
- Issue date Apr 14, 2020
- Fujitsu Limited
- Takeshi Shioga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loop heat pipe, manufacturing method thereof, and electronic device
- Patent number 10,420,253
- Issue date Sep 17, 2019
- Fujitsu Limited
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device, method of manufacturing the same, and electro...
- Patent number 9,711,433
- Issue date Jul 18, 2017
- Fujitsu Limited
- Jun Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection card for inspection, manufacture method for interco...
- Patent number 9,476,914
- Issue date Oct 25, 2016
- Fujitsu Limited
- Takeshi Shioga
- G01 - MEASURING TESTING
Information Patent Grant
Loop heat pipe system and information processing apparatus
- Patent number 9,455,212
- Issue date Sep 27, 2016
- Fujitsu Limited
- Hiroki Uchida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package, cooling mechanism and method for manufacturi...
- Patent number 9,142,476
- Issue date Sep 22, 2015
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loop heat pipe, and electronic apparatus including loop heat pipe
- Patent number 8,780,560
- Issue date Jul 15, 2014
- Fujitsu Limited
- Susumu Ogata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,479,386
- Issue date Jul 9, 2013
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,474,126
- Issue date Jul 2, 2013
- Fujitsu Limited
- Takeshi Shioga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laminated thin-film device, manufacturing method thereof, and circuit
- Patent number 8,344,386
- Issue date Jan 1, 2013
- Fujitsu Limited
- John David Baniecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection card for inspection, manufacture method for interco...
- Patent number 8,330,480
- Issue date Dec 11, 2012
- Fujitsu Limited
- Takeshi Shioga
- G01 - MEASURING TESTING
Information Patent Grant
Capacitive element, method of manufacture of the same, and semicond...
- Patent number 8,264,063
- Issue date Sep 11, 2012
- Fujitsu Limited
- Takeshi Shioga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin film capacitor device used for a decoupling capacitor and havi...
- Patent number 8,203,198
- Issue date Jun 19, 2012
- Fujitsu Limited
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 8,058,110
- Issue date Nov 15, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,035,981
- Issue date Oct 11, 2011
- Fujitsu Limited
- Takeshi Shioga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer and electronic device fabrication method
- Patent number 7,937,830
- Issue date May 10, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and electronic substrate including the same
- Patent number 7,940,516
- Issue date May 10, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method, semiconductor device fabrication method and circuit...
- Patent number 7,927,998
- Issue date Apr 19, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated thin-film device, manufacturing method thereof, and circuit
- Patent number 7,867,869
- Issue date Jan 11, 2011
- Fujitsu Limited
- John David Baniecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing the same
- Patent number 7,863,524
- Issue date Jan 4, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing capacitor embedded in interposer
- Patent number 7,846,852
- Issue date Dec 7, 2010
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor device and method of manufacturing the same
- Patent number 7,832,069
- Issue date Nov 16, 2010
- Fujitsu Limited
- Takeshi Shioga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of capacitor
- Patent number 7,793,396
- Issue date Sep 14, 2010
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method of manufacturing the same
- Patent number 7,795,739
- Issue date Sep 14, 2010
- Fujitsu Limited
- Kazuaki Kurihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIXTURE PHYSICAL PROPERTY IDENTIFICATION METHOD, MIXTURE PHYSICAL P...
- Publication number 20220164685
- Publication date May 26, 2022
- Fujitsu Limited
- Takeshi Shioga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION PROCESSING DEVICE, COMPUTER-READABLE RECORDING MEDIUM R...
- Publication number 20210256185
- Publication date Aug 19, 2021
- Fujitsu Limited
- Takeshi Shioga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOOP HEAT PIPE
- Publication number 20210232189
- Publication date Jul 29, 2021
- Shinko Electric Industries Co., Ltd.
- Takeshi SHIOGA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE
- Publication number 20210080192
- Publication date Mar 18, 2021
- Fujitsu Limited
- Takeshi SHIOGA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND ELECTRONIC DEVICE
- Publication number 20200281096
- Publication date Sep 3, 2020
- Fujitsu Limited
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND MANUFACTURING METHOD FOR LOOP HEAT PIPE AND ELEC...
- Publication number 20190090386
- Publication date Mar 21, 2019
- Fujitsu Limited
- Takeshi Shioga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOOP HEAT PIPE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20190075682
- Publication date Mar 7, 2019
- Fujitsu Limited
- Takeshi SHIOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE
- Publication number 20180177077
- Publication date Jun 21, 2018
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOOP HEAT PIPE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DE...
- Publication number 20160259383
- Publication date Sep 8, 2016
- Fujitsu Limited
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...
- Publication number 20160056089
- Publication date Feb 25, 2016
- Fujitsu Limited
- Jun Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, COOLING MECHANISM AND METHOD FOR MANUFACTURI...
- Publication number 20130223010
- Publication date Aug 29, 2013
- Fujitsu Limited
- Takeshi SHIOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERCO...
- Publication number 20130055567
- Publication date Mar 7, 2013
- Fujitsu Limited
- Takeshi Shioga
- G01 - MEASURING TESTING
Information Patent Application
LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE
- Publication number 20130044432
- Publication date Feb 21, 2013
- Fujitsu Limited
- Susumu Ogata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE
- Publication number 20120312506
- Publication date Dec 13, 2012
- Fujitsu Limited
- Hiroki UCHIDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE SYSTEM AND INFORMATION PROCESSING APPARATUS
- Publication number 20120227954
- Publication date Sep 13, 2012
- Fujitsu Limited
- Hiroki UCHIDA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME
- Publication number 20120132402
- Publication date May 31, 2012
- FUJITSU LIMITED
- Shigenori Aoki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110294265
- Publication date Dec 1, 2011
- Fujitsu Limited
- Takeshi SHIOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20110168564
- Publication date Jul 14, 2011
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated thin-film device, manufacturing method thereof, and circuit
- Publication number 20110073993
- Publication date Mar 31, 2011
- FUJITSU LIMITED
- John David Baniecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and method for manufacturing the same
- Publication number 20110056068
- Publication date Mar 10, 2011
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND ELECTRONIC SUBSTRATE INCLUDING THE SAME
- Publication number 20100321911
- Publication date Dec 23, 2010
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERC...
- Publication number 20100264951
- Publication date Oct 21, 2010
- FUJITSU LIMITED
- Takeshi Shioga
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER
- Publication number 20100233359
- Publication date Sep 16, 2010
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...
- Publication number 20100112775
- Publication date May 6, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING TH...
- Publication number 20090057827
- Publication date Mar 5, 2009
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090059545
- Publication date Mar 5, 2009
- Fujitsu Limited
- Takeshi SHIOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor device and method of manufacturing the same
- Publication number 20090007405
- Publication date Jan 8, 2009
- FUJITSU LIMITED
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive element, method of manufacture of the same, and semicond...
- Publication number 20080315358
- Publication date Dec 25, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film capacitor and fabrication method thereof
- Publication number 20080305607
- Publication date Dec 11, 2008
- FUJITSU LIMITED
- John David Baniecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer and electronic device fabrication method
- Publication number 20080257487
- Publication date Oct 23, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takeshi Shioga

Person

Patents Grantslast 30 patents

Information processing device, computer-readable recording medium r...

Loop heat pipe

Fabrication method for loop heat pipe

Loop heat pipe and electronic device

Loop heat pipe, method of manufacturing the same, and electronic de...

Loop heat pipe and fabrication method therefor, and electronic device

Loop heat pipe and manufacturing method for loop heat pipe and elec...

Loop heat pipe, manufacturing method thereof, and electronic device

Semiconductor device, method of manufacturing the same, and electro...

Interconnection card for inspection, manufacture method for interco...

Loop heat pipe system and information processing apparatus

Semiconductor package, cooling mechanism and method for manufacturi...

Loop heat pipe, and electronic apparatus including loop heat pipe

Method for manufacturing interposer

Manufacturing method of semiconductor device

Laminated thin-film device, manufacturing method thereof, and circuit

Interconnection card for inspection, manufacture method for interco...

Capacitive element, method of manufacture of the same, and semicond...

Thin film capacitor device used for a decoupling capacitor and havi...

Plating method, semiconductor device fabrication method and circuit...

Semiconductor device and manufacturing method of the same

Interposer and electronic device fabrication method

Capacitor and electronic substrate including the same

Plating method, semiconductor device fabrication method and circuit...

Laminated thin-film device, manufacturing method thereof, and circuit

Interposer and method for manufacturing the same

Method for manufacturing capacitor embedded in interposer

Capacitor device and method of manufacturing the same

Manufacturing method of capacitor

Semiconductor device, method of manufacturing the same

Patents Applicationslast 30 patents

MIXTURE PHYSICAL PROPERTY IDENTIFICATION METHOD, MIXTURE PHYSICAL P...

INFORMATION PROCESSING DEVICE, COMPUTER-READABLE RECORDING MEDIUM R...

LOOP HEAT PIPE

LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE

LOOP HEAT PIPE AND ELECTRONIC DEVICE

LOOP HEAT PIPE AND MANUFACTURING METHOD FOR LOOP HEAT PIPE AND ELEC...

LOOP HEAT PIPE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE

LOOP HEAT PIPE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DE...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...

SEMICONDUCTOR PACKAGE, COOLING MECHANISM AND METHOD FOR MANUFACTURI...

INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERCO...

LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE

LOOP HEAT PIPE

LOOP HEAT PIPE SYSTEM AND INFORMATION PROCESSING APPARATUS

LOOP HEAT PIPE AND STARTUP METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...

Laminated thin-film device, manufacturing method thereof, and circuit

Interposer and method for manufacturing the same

CAPACITOR AND ELECTRONIC SUBSTRATE INCLUDING THE SAME

INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERC...

METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER

PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT...

CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING TH...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Capacitor device and method of manufacturing the same

Capacitive element, method of manufacture of the same, and semicond...

Thin film capacitor and fabrication method thereof

Interposer and electronic device fabrication method