Takeshi Takahashi

Person

Hitachiota, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for removing solder bumps from LSI
- Patent number 7,401,393
- Issue date Jul 22, 2008
- Hitachi, Ltd.
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing solder bumps from LSI
- Patent number 6,739,045
- Issue date May 25, 2004
- Hitachi, Ltd.
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder removing apparatus
- Patent number 6,325,270
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Takeshi Kuroda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method
- Patent number 5,709,338
- Issue date Jan 20, 1998
- Hitachi, Ltd.
- Mitugu Shirai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cooling rolled steels
- Patent number 4,786,338
- Issue date Nov 22, 1988
- Norio Anzawa
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Gas-insulated switchgear equipment
- Patent number 4,570,202
- Issue date Feb 11, 1986
- Hitachi, Ltd.
- Isao Nishida
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Gas-insulated switchgear equipment
- Patent number 4,535,383
- Issue date Aug 13, 1985
- Hitachi, Ltd.
- Yukinori Yamaoka
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Gas insulated switchgear equipment
- Patent number 4,503,481
- Issue date Mar 5, 1985
- Hitachi, Ltd.
- Sigeru Fujiya
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Puffer type current interrupter
- Patent number 4,442,330
- Issue date Apr 10, 1984
- Hitachi, Ltd.
- Youichi Oshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas circuit breaker of resistance breaking type
- Patent number 4,423,298
- Issue date Dec 27, 1983
- Hitachi, Ltd.
- Masanori Tsukushi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-phase combined type circuit breaker
- Patent number 4,417,111
- Issue date Nov 22, 1983
- Hitachi, Ltd.
- Tuneo Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas circuit breaker
- Patent number 4,365,126
- Issue date Dec 21, 1982
- Hitachi, Ltd.
- Masabumi Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for checking electric contacts of an enclosed-type switching...
- Patent number 4,263,491
- Issue date Apr 21, 1981
- Hitachi, Ltd.
- Masaki Murashita
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LED PACKAGE AND METHOD O...
- Publication number 20130001632
- Publication date Jan 3, 2013
- Hitachi Cable, Ltd.
- Noboru IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE
- Publication number 20130001633
- Publication date Jan 3, 2013
- Hitachi Cable, Ltd.
- Noboru IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing solder bumps from LSI
- Publication number 20040206805
- Publication date Oct 21, 2004
- Hitachi, Ltd
- Motoko Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for removing solder bumps from LSI
- Publication number 20030034380
- Publication date Feb 20, 2003
- Hitachi, Ltd
- Motoko Kimura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Takeshi Takahashi

Person

Patents Grantslast 30 patents

Method for removing solder bumps from LSI

Method for removing solder bumps from LSI

Solder removing apparatus

Soldering method

Method for cooling rolled steels

Gas-insulated switchgear equipment

Gas-insulated switchgear equipment

Gas insulated switchgear equipment

Puffer type current interrupter

Gas circuit breaker of resistance breaking type

Three-phase combined type circuit breaker

Gas circuit breaker

Method for checking electric contacts of an enclosed-type switching...

Patents Applicationslast 30 patents

LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LED PACKAGE AND METHOD O...

LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE

Method for removing solder bumps from LSI

Method for removing solder bumps from LSI